公开(公告)号：US20160052786A1

公开(公告)日：2016-02-25

申请号：US14832385

申请日：2015-08-21

申请人： Sunshine PV Corporation

发明人： William Weijien Hou ,  Sheng Han Li ,  Tzu Chen

IPC分类号： C01B19/04 ,  B05D3/00 ,  B05D7/00 ,  C01B19/00

CPC分类号： C01B19/04 ,  B05D3/007 ,  B05D7/50 ,  C01B19/007 ,  H01L21/02422 ,  H01L21/02491 ,  H01L21/0256 ,  H01L21/02562 ,  H01L21/02568 ,  H01L21/02614 ,  H01L21/02667 ,  H01L31/0322 ,  H01L31/0326 ,  H01L31/1828 ,  H01L31/1836 ,  H01L31/1872 ,  Y02E10/541 ,  Y02E10/543 ,  Y02P70/521

摘要： The present invention provides a heat treatment method, particularly a heat treatment method in which a protective layer is directly applied onto a precursor to ensure that the precursor on each portion of the substrate is treated based on substantially the same conditions so that the quality of the prepared product layer is improved. The method of the present invention comprises: (1) providing a substrate; (2) applying a precursor onto the surface of the substrate; (3) covering the precursor-applied substrate with a protective layer to bring the substrate and the protective layer into direct contact; (4) placing the substrate obtained from step (3) into a heat chamber for heat treatment; and (5) removing the protective layer. A product prepared by said heat treatment method is also provided.

摘要翻译： 本发明提供一种热处理方法，特别是一种热处理方法，其中将保护层直接施加到前体上，以确保基于基本上相同的条件来处理基底的每个部分上的前体，使得质量 制备产品层得到改善。 本发明的方法包括：（1）提供基底; （2）将前体涂布在基材的表面上; （3）用保护层覆盖前体施加的基板，使基板和保护层直接接触; （4）将从步骤（3）获得的基板放置在用于热处理的加热室中; 和（5）去除保护层。 还提供了通过所述热处理方法制备的产品。

公开(公告)号：US10053364B2

公开(公告)日：2018-08-21

申请号：US14832385

申请日：2015-08-21

申请人： Sunshine PV Corporation

发明人： William Weijen Hou ,  Sheng Han Li ,  Tzu Pin Chen

IPC分类号： C01B19/04 ,  C01B19/00 ,  B05D3/00 ,  B05D7/00 ,  H01L31/032 ,  H01L31/18 ,  H01L21/02

CPC分类号： C01B19/04 ,  B05D3/007 ,  B05D7/50 ,  C01B19/007 ,  H01L21/02422 ,  H01L21/02491 ,  H01L21/0256 ,  H01L21/02562 ,  H01L21/02568 ,  H01L21/02614 ,  H01L21/02667 ,  H01L31/0322 ,  H01L31/0326 ,  H01L31/1828 ,  H01L31/1836 ,  H01L31/1872 ,  Y02E10/541 ,  Y02E10/543 ,  Y02P70/521

摘要： The present invention provides a heat treatment method, particularly a heat treatment method in which a protective layer is directly applied onto a precursor to ensure that the precursor on each portion of the substrate is treated based on substantially the same conditions so that the quality of the prepared product layer is improved. The method of the present invention comprises: (1) providing a substrate; (2) applying a precursor onto the surface of the substrate; (3) covering the precursor-applied substrate with a protective layer to bring the substrate and the protective layer into direct contact; (4) placing the substrate obtained from step (3) into a heat chamber for heat treatment; and (5) removing the protective layer. A product prepared by said heat treatment method is also provided.