公开(公告)号：US20230013387A1

公开(公告)日：2023-01-19

申请号：US17618939

申请日：2020-06-26

Applicant: Sunstar Engineering Inc.

Inventor： Takatomi NISHIDA ,  Kazuaki HANASAKI ,  Takashi MINAMIHORI

IPC: C08L63/00 ,  C08L33/08 ,  C08G18/80 ,  C08G59/50 ,  C09J175/08 ,  C08G18/32 ,  C08G18/58 ,  C08G18/48 ,  C08G18/76 ,  C08G18/10 ,  C08G18/64 ,  C08G18/28

Abstract: Disclosed is a low-temperature curable composition comprising: (A) at least one curable component selected from an epoxy resin and a blocked isocyanate, and (B) an amine-based latent curing agent, wherein a temperature peak of a reaction of the amine-based latent curing agent (B) with a bisphenol A type epoxy resin is between 70° C. and 110° C.