公开(公告)号：US4819327A

公开(公告)日：1989-04-11

申请号：US17532

申请日：1987-02-24

申请人： Syuuzi Tatsuoka ,  Hiroshi Sekiyama ,  Kanji Ishige

发明人： Syuuzi Tatsuoka ,  Hiroshi Sekiyama ,  Kanji Ishige

IPC分类号： B23K1/00 ,  B23K1/08 ,  H05K3/34

CPC分类号： B23K1/08 ,  H05K3/3468 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2203/046 ,  H05K3/3405 ,  Y10T29/49144

摘要： This invention relates to a method of soldering electronic components for a printed circuit board by dipping the printed circuit board into a molten solder inside a soldering bath. When the printed circuit board is dipped into the molten solder inside the soldering bath, it is dipped together with a member that attracts the molten solder, and when the printed circuit board is pulled up from the molten solder, it is pulled up while the edge of the member keeps contact with a solder connection portion of the printed circuit board. After the printed circuit board is pulled from the molten solder, the edge of the member is separated from the printed circuit board to remove any excessive solder adhering to the connection portion by the surface tension of the solder.

摘要翻译： 本发明涉及一种通过将印刷电路板浸入焊接槽内的熔融焊料来焊接印刷电路板的电子部件的方法。 当印刷电路板浸入焊锡槽内的熔融焊料中时，将其与吸引熔融焊料的部件浸在一起，并且当印刷电路板从熔融焊料中拉出时，其被拉起，而边缘 的构件与印刷电路板的焊接连接部分保持接触。 在从熔融焊料拉出印刷电路板之后，该部件的边缘与印刷电路板分离，以通过焊料的表面张力除去附着在连接部分上的任何过量的焊料。