公开(公告)号：US20180206346A1

公开(公告)日：2018-07-19

申请号：US15786658

申请日：2017-10-18

申请人： Unlimiter MFA Co., Ltd.

发明人： Kuo-Ping YANG ,  Yi-Yen CHIANG ,  Neo Bob Chih-Yung YOUNG ,  Lin-He CHU ,  Wen-Chiang WU

IPC分类号： H05K3/42 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K1/11

CPC分类号： H05K3/426 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/099 ,  H05K2203/045 ,  H05K2203/046 ,  H05K2203/0557 ,  H05K2203/1344

摘要： A printed circuit board manufacturing method and a printed circuit board thereof are disclosed. The printed circuit board manufacturing method includes the steps of: providing a dielectric; performing a layout process on a surface of the dielectric; drilling the dielectric to form at least one plated through hole, wherein the at least one plated through hole has an annular ring disposed on the surface of the dielectric; and coating a solder resist on the surface of the dielectric to cover at least one part of the annular ring.

公开(公告)号：US09950393B2

公开(公告)日：2018-04-24

申请号：US13976001

申请日：2011-12-23

申请人： Rajen S. Sidhu ,  Martha A. Dudek ,  James C. Matayabas, Jr. ,  Michelle S. Phen ,  Wei Tan

发明人： Rajen S. Sidhu ,  Martha A. Dudek ,  James C. Matayabas, Jr. ,  Michelle S. Phen ,  Wei Tan

IPC分类号： B23K35/02 ,  B23K35/362 ,  H01L23/00 ,  H05K3/34 ,  H01L23/488 ,  H01L23/498 ,  H01L21/48

CPC分类号： B23K35/025 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0381 ,  H01L2224/03828 ,  H01L2224/03829 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/05794 ,  H01L2224/058 ,  H01L2224/05809 ,  H01L2224/05811 ,  H01L2224/05813 ,  H01L2224/05817 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/046 ,  H01L2924/014 ,  H01L2924/01032 ,  H01L2924/01105 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/01083

摘要： Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.

公开(公告)号：US09468107B2

公开(公告)日：2016-10-11

申请号：US14695216

申请日：2015-04-24

申请人： Texas Instruments Incorporated

发明人： Allan Jerome Daen Rapales ,  Floro Lopez Camenforte, III ,  John Paul Quianzon Kwo

IPC分类号： H05K3/34 ,  H01G2/06 ,  H01G4/232 ,  H05K1/18 ,  H05K3/00 ,  H05K3/30 ,  H01G4/30

CPC分类号： H05K3/3442 ,  H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/18 ,  H05K1/183 ,  H05K3/0014 ,  H05K3/301 ,  H05K3/3452 ,  H05K2201/0162 ,  H05K2201/09036 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2203/0126 ,  H05K2203/046 ,  H05K2203/167 ,  H05K2203/168 ,  Y02P70/613 ,  Y10T29/43 ,  Y10T29/49135

摘要： A method of registering terminals on an interdigitated chip capacitor (“IDC”) with a plurality of contact pads on a substrate. At least one vertically extending nonconductive abutment surface is formed between adjacent ones of the contact pads. A plurality of grooves projecting outwardly from said a central recess is formed on the substrate top portion. At least one sidewall portion of the IDC is urged into abutting engagement with the at least one abutment surface on the substrate. Another method prevent solder from causing short circuits between adjacent terminals. A plurality of grooves extending laterally outwardly from a central recessed portion are formed. The plurality of grooves defining a plurality of inwardly projecting fingers. A plurality of contact pads on are formed on a respective plurality of fingers. A solder bead is formed on at least some of the plurality of contact pads. The at least one solder bead is isolated from adjacent solder beads and adjacent terminals.

摘要翻译： 一种在叉指片式电容器（“IDC”）上的端子与衬底上的多个接触焊盘对准的方法。 在相邻的接触垫之间形成至少一个垂直延伸的非导电邻接表面。 在所述基板顶部形成有从所述中心凹部向外突出的多个凹槽。 IDC的至少一个侧壁部分被推动成与基底上的至少一个邻接表面邻接接合。 另一种方法可以防止焊料在相邻端子之间引起短路。 形成从中心凹部横向向外延伸的多个槽。 多个槽限定多个向内突出的指状物。 在多个指状物上形成多个接触垫。 在多个接触垫中的至少一些上形成焊珠。 至少一个焊珠与相邻的焊球和相邻的端子隔离。

公开(公告)号：US20140345920A1

公开(公告)日：2014-11-27

申请号：US14273657

申请日：2014-05-09

申请人： Nitto Denko Corporation

发明人： Terukazu IHARA ,  Naohiro TERADA

IPC分类号： H05K1/09 ,  H05K3/34

CPC分类号： H05K3/3405 ,  G11B5/4853 ,  H05K2201/09427 ,  H05K2201/09727 ,  H05K2203/046 ,  Y10T29/49147

摘要： Heat-assisted wiring traces and a conductive support substrate are respectively formed on first and second surfaces of an insulating layer. Further, connection terminals electrically insulated from the support substrate and electrically respectively connected to the heat-assisted wiring traces are formed on the second surface of the insulating layer. Each connection terminal has an element connection portion, a pattern connection portion and a spread blocking portion. When a circuit element is connected to the element connection portion of the connection terminal by solder, spreading of a molten solder applied to the element connection portion to the pattern connection portion is blocked by the spread blocking portion.

摘要翻译： 分别在绝缘层的第一和第二表面上形成热辅助布线和导电支撑基板。 此外，在绝缘层的第二表面上形成与支撑基板电绝缘并电连接到热辅助布线的连接端子。 每个连接端子具有元件连接部分，图案连接部分和展开阻挡部分。 当通过焊料将电路元件连接到连接端子的元件连接部分时，施加到元件连接部分的熔融焊料向图案连接部分的扩散被扩展阻挡部分阻挡。

公开(公告)号：US20130341379A1

公开(公告)日：2013-12-26

申请号：US13976001

申请日：2011-12-23

申请人： Rajen S. Sidhu ,  Martha A. Dudek ,  James C. Matayabas ,  Michelle S. Phen ,  Wei Tan

发明人： Rajen S. Sidhu ,  Martha A. Dudek ,  James C. Matayabas ,  Michelle S. Phen ,  Wei Tan

IPC分类号： B23K35/02 ,  B23K35/362

CPC分类号： B23K35/025 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0381 ,  H01L2224/03828 ,  H01L2224/03829 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/05794 ,  H01L2224/058 ,  H01L2224/05809 ,  H01L2224/05811 ,  H01L2224/05813 ,  H01L2224/05817 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/046 ,  H01L2924/014 ,  H01L2924/01032 ,  H01L2924/01105 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/01083

摘要： Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.

摘要翻译： 描述了在制造电子器件组件期间的焊剂配方和焊料附着。 一种助熔剂组合包括助熔剂组分和金属颗粒组分，金属颗粒组分的存在量为助熔剂配方的5-35体积％。 在某些实施方案的一个特征中，金属颗粒组分包括焊料颗粒。 描述和要求保护其他实施例。

公开(公告)号：US08309862B2

公开(公告)日：2012-11-13

申请号：US12499830

申请日：2009-07-09

申请人： Tsuyoshi Miura

发明人： Tsuyoshi Miura

IPC分类号： H05K1/11 ,  H05K7/00 ,  H05K1/14

CPC分类号： H05K3/3468 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2203/046 ,  Y10T29/49149

摘要： A printed circuit board 1 is provided, which includes: soldering lands for connecting respective leads of a dual inline lead-type electronic part 2 by jet-type soldering; and a solder-drawing land 4 for absorbing excessive solder during soldering, which is arranged at a position behind the rearmost soldering lands 3h in the traveling direction of jet-type soldering. The solder-drawing land has a square outer shape and includes a slit 4a in a bent shape therein. One corner of the square is located near the rearmost soldering lands 3h and arranged between the leads, while a bent portion of the slit is arranged near the one corner.

摘要翻译： 提供一种印刷电路板1，其包括：用于通过喷射式焊接连接双列直插式电子部件2的各个引线的焊接区域; 以及用于在焊接期间吸收过量焊料的焊接区域4，其布置在喷射型焊接的行进方向上的最后面的焊盘3h的后面的位置。 焊接区域具有正方形的外部形状并且包括弯曲形状的狭缝4a。 正方形的一个角落位于最后面的焊接区域3h附近，并布置在引线之间，而狭缝的弯曲部分设置在一个角落附近。

公开(公告)号：US20100193233A1

公开(公告)日：2010-08-05

申请号：US12499830

申请日：2009-07-09

申请人： Tsuyoshi Miura

发明人： Tsuyoshi Miura

IPC分类号： H05K1/11 ,  H05K3/00

CPC分类号： H05K3/3468 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2203/046 ,  Y10T29/49149

摘要： A printed circuit board 1 is provided, which includes: soldering lands for connecting respective leads of a dual inline lead-type electronic part 2 by jet-type soldering; and a solder-drawing land 4 for absorbing excessive solder during soldering, which is arranged at a position behind the rearmost soldering lands 3h in the traveling direction of jet-type soldering. The solder-drawing land has a square outer shape and includes a slit 4a in a bent shape therein. One corner of the square is located near the rearmost soldering lands 3h and arranged between the leads, while a bent portion of the slit is arranged near the one corner.

摘要翻译： 提供一种印刷电路板1，其包括：用于通过喷射式焊接连接双列直插式电子部件2的各个引线的焊接区域; 以及用于在焊接期间吸收过量焊料的焊接区域4，其布置在喷射型焊接的行进方向上的最后面的焊盘3h的后面的位置。 焊接区域具有正方形的外部形状并且包括弯曲形状的狭缝4a。 正方形的一个角落位于最后面的焊接区域3h附近，并布置在引线之间，而狭缝的弯曲部分设置在一个角落附近。

公开(公告)号：US07710738B2

公开(公告)日：2010-05-04

申请号：US11516565

申请日：2006-09-07

申请人： Tsuyoshi Miura

发明人： Tsuyoshi Miura

IPC分类号： H05K7/00

CPC分类号： H05K3/3468 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2203/046

摘要： A printed circuit board 1 including a group of consecutive soldering lands 3 for soldering a lead-type electronic part 2 with a plurality of leads 2a, includes a solder drawing land 4 having a cross-shaped slit 4a and being provided adjacently to a rearmost portion of the group of the consecutive soldering lands 3.

摘要翻译： 包括一组用于焊接具有多根引线2a的引线型电子部件2的连续焊接区域3的印刷电路板1包括具有十字形狭缝4a并且设置成与最后部分相邻的焊料引导区域4 连续焊台3组。

公开(公告)号：US20100046185A1

公开(公告)日：2010-02-25

申请号：US12544156

申请日：2009-08-19

申请人： Hideaki Hirasawa

发明人： Hideaki Hirasawa

IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K1/00

CPC分类号： H05K1/11 ,  H05K1/0203 ,  H05K1/111 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3468 ,  H05K2201/09772 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/10522 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2203/046 ,  Y02P70/611

摘要： A printed circuit board has a first solder land, a second solder land, and a signal line pattern. The first solder land is configured to be soldered with an electronic part. The second solder land is configured to accumulate solder, the second solder land being disposed on a downstream side of the first solder land as viewed in a direction in which the printed circuit is carried. The signal line pattern includes an exposed part that is not covered with a resist, the exposed part being disposed between the solder land and the solder bridge prevention land.

摘要翻译： 印刷电路板具有第一焊盘焊盘，第二焊盘焊盘和信号线图案。 第一焊盘被配置为与电子部件焊接。 第二焊盘被构造为蓄积焊料，第二焊盘位于沿着印刷电路的携带方向设置在第一焊盘的下游侧。 信号线图案包括未被抗蚀剂覆盖的暴露部分，暴露部分设置在焊接区域和防止桥接防止焊盘之间。

公开(公告)号：US07223921B2

公开(公告)日：2007-05-29

申请号：US10471464

申请日：2002-02-14

申请人： Lutz Rissing ,  Peter Fischer

发明人： Lutz Rissing ,  Peter Fischer

IPC分类号： H05K1/00

CPC分类号： H05K3/363 ,  H01L2924/00013 ,  H05K1/111 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2203/046 ,  Y02P70/611 ,  H01L2224/29099

摘要： A composite of at least two flat elements that includes a first support substrate having a first solder pad, and a second support substrate having a second solder pad that is soldered together with the first solder pad. Strip conductor structures are applied to the first support substrate and the second support substrate and a link area that connects a solder shunting area with the first solder pad, wherein the link area is narrower than the first solder pad and the solder shunting area.

摘要翻译： 包括至少两个扁平元件的复合材料，其包括具有第一焊盘的第一支撑衬底和具有与第一焊盘一起焊接的第二焊盘的第二支撑衬底。 带状导体结构被施加到第一支撑基板和第二支撑基板以及连接区域，该连接区域将焊接分流区域与第一焊盘连接，其中连接区域比第一焊盘和焊料分流区域窄。