SEMICONDUCTOR MEMORY WITH RESPECTIVE POWER VOLTAGES FOR MEMORY CELLS

    公开(公告)号:US20180277199A1

    公开(公告)日:2018-09-27

    申请号:US15991739

    申请日:2018-05-29

    Abstract: A device is disclosed that includes a plurality of first memory cells, a plurality of second memory cells, a power circuit, and a header circuit. The power circuit us configured to provide the first power voltage for the plurality of first memory cells, and to provide the second power voltage, that is independent from the first power voltage, for the plurality of second memory cells. The header circuit is configured to provide, during the write operation, the first voltage smaller than the first power voltage, the second power voltage, or the combination thereof, for corresponding memory cells of the plurality of first memory cells and the plurality of second memory cells.

    SEMICONDUCTOR MEMORY
    2.
    发明申请

    公开(公告)号:US20170178719A1

    公开(公告)日:2017-06-22

    申请号:US15336633

    申请日:2016-10-27

    CPC classification number: G11C11/419

    Abstract: A device is disclosed that includes first memory cells, second memory cells, a first conductive line and a second conductive line. The first conductive line is electrically disconnected from the second conductive line. The first conductive line receives a first power voltage for the plurality of first memory cells. The second conductive line receives a second power voltage that is independent from the first power voltage, for the plurality of second memory cells.

    SEMICONDUCTOR MEMORY WITH RESPECTIVE POWER VOLTAGES FOR MEMORY CELLS

    公开(公告)号:US20200381043A1

    公开(公告)日:2020-12-03

    申请号:US16997857

    申请日:2020-08-19

    Abstract: A device is disclosed that includes a plurality of first memory cells, a plurality of second memory cells, a power circuit, and a header circuit. The power circuit is configured to provide a first power voltage via a conductive line for the plurality of first memory cells, and to provide a second power voltage, that is independent from the first power voltage, for the plurality of second memory cells. The header circuit is configured to provide, during the write operation, the first voltage smaller than the first power voltage, the second power voltage, or smaller than the first power voltage and the second power voltage, for corresponding memory cells of the plurality of first memory cells via the conductive line and for corresponding memory cells of the plurality of second memory cells. A circuit structure of the power circuit is different from a circuit structure of the header circuit.

    SRAM CELL WORD LINE STRUCTURE WITH REDUCED RC EFFECTS

    公开(公告)号:US20210265363A1

    公开(公告)日:2021-08-26

    申请号:US17320091

    申请日:2021-05-13

    Abstract: A device is disclosed that includes a fin structure disposed below a first metal layer, extending along a column direction, and corresponding to at least one transistor of a memory bit cell, a word line disposed in the first metal layer and extending along a row direction, a first metal island disposed in the first metal layer separated from the word line, and a first connection metal line disposed in a second metal layer above the first metal layer, extending along the column direction, and configured to couple a power supply through the first metal island to the fin structure. In a layout view, the first connection metal line is separated from the fin structure, and the fin structure crosses over the word line and the first metal island. A method is also disclosed herein.

Patent Agency Ranking