公开(公告)号：US20170213759A1

公开(公告)日：2017-07-27

申请号：US15007041

申请日：2016-01-26

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Chih-Yu MA ,  Yii-Chi LIN ,  Zheng-Yang PAN ,  Chia-Chiung LO

IPC分类号： H01L21/687 ,  H01L21/66 ,  H01L21/324 ,  H01L21/67

CPC分类号： H01L21/68785 ,  H01L21/324 ,  H01L21/67115 ,  H01L21/67248 ,  H01L21/68757 ,  H01L21/68792 ,  H01L22/20

摘要： A wafer supporting structure in semiconductor manufacturing, and a device and a method for manufacturing semiconductor are provided. In accordance with some embodiments of the instant disclosure, a wafer supporting structure in semiconductor manufacturing includes a transparent ring and at least two arms. The arms are connected to the transparent ring.