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公开(公告)号：US09584003B2
公开(公告)日：2017-02-28
申请号：US14993142
申请日：2016-01-12
发明人： Tien-Kan Chung , Wen-Chuan Tai , Yao-Te Huang , Hsin-Ting Huang , Shang-Ying Tsai , Chang-Yi Yang , Chia-Ming Hung
CPC分类号： H02K35/04 , B81B7/02 , G01P15/11 , H01F5/003 , H02K15/00 , H02M7/04 , H02N1/006 , Y10T29/49009
摘要： A semiconductor device includes a moveable element over a substrate, wherein the moveable element is moveable relative to the substrate. The semiconductor device further includes a first anchor portion connected to the substrate; and a second anchor portion connected to the substrate on an opposite side of the moveable element from the first anchor portion. The semiconductor device further includes a first connector configured to connect the moveable element to the first anchor portion. The semiconductor device further includes a second connector configured to connect the moveable element to the second anchor portion. The semiconductor device further includes a conductive wire loop on the moveable element; and a connection wire electrically connected to a first end of the conductive wire loop, wherein the connection wire extends across the first connector to the first anchor portion.
摘要翻译： 半导体器件包括在衬底上的可移动元件，其中可移动元件可相对于衬底移动。 半导体器件还包括连接到衬底的第一锚定部分; 以及第二锚固部分，其在与所述第一锚固部分相对的所述可移动元件的相对侧上连接到所述基板。 半导体器件还包括被配置为将可移动元件连接到第一锚定部分的第一连接器。 半导体器件还包括被配置为将可移动元件连接到第二锚定部分的第二连接器。 半导体器件还包括在可移动元件上的导线回路; 以及连接线，其电连接到所述导线回路的第一端，其中所述连接线穿过所述第一连接器延伸到所述第一锚固部分。
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公开(公告)号：US08928162B2
公开(公告)日：2015-01-06
申请号：US14229068
申请日：2014-03-28
发明人： Tien-Kan Chung , Wen-Chuan Tai , Yao-Te Huang , Hsin-Ting Huang , Shang-Ying Tsai , Chang-Yi Yang , Chia-Ming Hung
CPC分类号： H02K35/04 , B81B7/02 , G01P15/11 , H01F5/003 , H02K15/00 , H02M7/04 , H02N1/006 , Y10T29/49009
摘要： A method of fabricating a device includes forming a moveable plate over a substrate, and forming an energy harvesting coil in the moveable plate. The method further includes forming at least one connector connecting the movable plate with the energy harvesting coil, wherein a portion of the energy harvesting coil extends along the at least one connector. The method further includes forming electrodes around the moveable plate, the electrodes adapted to sense motion of the moveable plate.
摘要翻译： 一种制造器件的方法包括在衬底上形成可移动板，并在可移动板中形成能量收集线圈。 该方法还包括形成连接可移动板与能量收集线圈的至少一个连接器，其中能量收集线圈的一部分沿着至少一个连接器延伸。 该方法还包括在可移动板周围形成电极，电极适于感测可移动板的运动。
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公开(公告)号：US08763220B2
公开(公告)日：2014-07-01
申请号：US13765556
申请日：2013-02-12
发明人： Tien-Kan Chung , Chung-Hsien Lin , Yao-Te Huang , Chia-Hua Chu , Chia-Ming Hung , Wen-Chuan Tai , Chang-Yi Yang
IPC分类号： H01L41/22 , H01L41/311 , H01L41/113 , H01L41/312 , B81C1/00
CPC分类号： H01L41/311 , B81B3/0021 , B81C1/00 , H01L41/113 , H01L41/1136 , H01L41/1138 , H01L41/22 , H01L41/312 , H02K35/04 , H02N2/186 , Y10T29/42 , Y10T29/49005 , Y10T29/49073 , Y10T29/49075 , Y10T29/49146
摘要： Provided is a manufacturing method for a micro device. The manufacturing method includes forming a micro-electronic-mechanical system (MEMS) movable structure, forming a plurality of metal loops over the MEMS movable structure, forming a piezoelectric element over the MEMS movable structure, and a magnet disposed over the plurality of metal loops. The method also includes encapsulating the MEMS movable structure, the plurality of metal loops, and the piezoelectric element.
摘要翻译： 提供了一种微型器件的制造方法。 制造方法包括形成微电子机械系统（MEMS）可移动结构，在MEMS可移动结构上形成多个金属环，在MEMS可移动结构上形成压电元件，以及设置在多个金属环上的磁体 。 该方法还包括封装MEMS可移动结构，多个金属环和压电元件。
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公开(公告)号：US20130147317A1
公开(公告)日：2013-06-13
申请号：US13765556
申请日：2013-02-12
发明人： Tien-Kan Chung , Chung-Hsien Lin , Yao-Te Huang , Chia-Hua Chu , Chia-Ming Hung , Wen-Chuan Tai , Chang-Yi Yang
IPC分类号： H01L41/113
CPC分类号： H01L41/311 , B81B3/0021 , B81C1/00 , H01L41/113 , H01L41/1136 , H01L41/1138 , H01L41/22 , H01L41/312 , H02K35/04 , H02N2/186 , Y10T29/42 , Y10T29/49005 , Y10T29/49073 , Y10T29/49075 , Y10T29/49146
摘要： The present disclosure provides a micro device. The device has a micro-electro-mechanical systems (MEMS) movable structure, a plurality of metal loops over the MEMS movable structure, a piezoelectric element over the MEMS movable structure, and a magnet disposed over the plurality of metal loops. The MEMS movable structure, the plurality of metal loops, and the piezoelectric element are encapsulated.
摘要翻译： 本公开提供了微型装置。 该装置具有微电子机械系统（MEMS）可移动结构，MEMS可移动结构上的多个金属环，MEMS可移动结构上的压电元件，以及设置在多个金属环上的磁体。 MEMS可移动结构，多个金属环和压电元件被封装。
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公开(公告)号：US09246401B2
公开(公告)日：2016-01-26
申请号：US14567423
申请日：2014-12-11
发明人： Tien-Kan Chung , Wen-Chuan Tai , Yao-Te Huang , Hsin-Ting Huang , Shang-Ying Tsai , Chang-Yi Yang , Chia-Ming Hung
CPC分类号： H02K35/04 , B81B7/02 , G01P15/11 , H01F5/003 , H02K15/00 , H02M7/04 , H02N1/006 , Y10T29/49009
摘要： A method of fabricating a device includes forming a moveable plate over a substrate. The method further includes forming an energy harvesting coil in the moveable plate. The method further includes forming at least one connector connecting the movable plate with the substrate, wherein a portion of the energy harvesting coil extends along the at least one connector. The method further includes enclosing the movable plate using a capping wafer.
摘要翻译： 一种制造器件的方法包括在衬底上形成可移动板。 该方法还包括在可移动板中形成能量收集线圈。 该方法还包括形成连接可移动板与衬底的至少一个连接器，其中能量收集线圈的一部分沿着至少一个连接器延伸。 该方法还包括使用封盖晶片包围可动板。
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