公开(公告)号：US20180151466A1

公开(公告)日：2018-05-31

申请号：US15658948

申请日：2017-07-25

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Ying-Chih HSU ,  Alan ROTH ,  Chuei-Tang WANG ,  Chih-Yuan CHANG ,  Eric SOENEN ,  Chih-Lin CHEN

IPC分类号： H01L23/367 ,  H01L23/48 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L23/3677 ,  H01L21/486 ,  H01L23/481 ,  H01L23/49822 ,  H01L2224/18

摘要： A package structure includes a first package layer, a second package layer, and a chip layer positioned between the first package layer and the second package layer. The first package layer includes an electrical signal structure electrically isolated from a first thermal conduction structure. The chip layer includes an integrated circuit (IC) chip electrically connected to the electrical signal structure, a molding material, and a through-via positioned in the molding material. The first thermal conduction structure, the through-via, and the second thermal conduction structure are configured as a low thermal resistance path from the IC chip to a surface of the second package layer opposite the chip layer.

公开(公告)号：US20190157180A1

公开(公告)日：2019-05-23

申请号：US16204953

申请日：2018-11-29

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Ying-Chih HSU ,  Alan ROTH ,  Chuei-Tang WANG ,  Chih-Yuan CHANG ,  Eric SOENEN ,  Chih-Lin CHEN

IPC分类号： H01L23/367 ,  H01L23/498 ,  H01L23/48 ,  H01L21/48

CPC分类号： H01L23/3677 ,  H01L21/486 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/5389 ,  H01L2224/18

摘要： An integrated circuit (IC) package structure includes an electrical signal path, a low thermal resistance path and a substrate that includes a first device and a second device. The first device and the second device are part of an IC chip. The electrical signal path is from the first device to a top surface of the IC chip. The low thermal resistance path extends from the second device to the top surface of the IC chip. The low thermal resistance path is electrically isolated from the electrical signal path. The second device is thermally coupled to the first device by a low thermal resistance substrate path.

公开(公告)号：US20200176349A1

公开(公告)日：2020-06-04

申请号：US16785248

申请日：2020-02-07

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Ying-Chih HSU ,  Alan ROTH ,  Chuei-Tang WANG ,  Chih-Yuan CHANG ,  Eric SOENEN ,  Chih-Lin CHEN

IPC分类号： H01L23/367 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498

摘要： A method of transferring heat in a package includes conducting heat from a first device to a second device by a low thermal resistance substrate path in a chip layer of the package, conducting heat from an integrated circuit (IC) to a first package layer of the package, conducting heat from the first package layer of the package to at least a first set of through-vias positioned in the chip layer, and conducting heat from the first set of through-vias to a surface of a second package layer opposite the chip layer. The first device and the second device is part of the IC chip. The first package layer is adjacent to the chip layer.