-
公开(公告)号：US20160104940A1
公开(公告)日：2016-04-14
申请号：US14510796
申请日：2014-10-09
发明人： Chuei-Tang WANG , Jeng-Shieh HSIEH , Chung-Hao TSAI , Monsen LIU , Chen-Hua YU
IPC分类号： H01Q19/10 , H01Q19/185 , H01Q19/00
CPC分类号： H01Q21/065 , H01L23/66 , H01L24/20 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01Q1/2283 , H01Q19/005 , H01Q19/10 , H01Q19/185
摘要： An integrated fan out (InFO) antenna includes a reflector on a surface of a substrate; and a package. The package includes a redistribution layer (RDL) arranged to form an antenna ground, and a patch antenna over the RDL, wherein the RDL is between the patch antenna and the reflector. The InFO antenna further includes a plurality of connecting elements bonding the package to the reflector. Each connecting element of the plurality of connecting elements is located inside an outer perimeter of the reflector. The InFO antenna is configured to output a signal having a wavelength.
摘要翻译： 集成的风扇输出（InFO）天线包括在基板的表面上的反射器; 和一个包。 该封装包括布置成形成天线接地的再分配层（RDL）和RDL上的贴片天线，其中RDL位于贴片天线和反射器之间。 InFO天线还包括将封装结合到反射器的多个连接元件。 多个连接元件的每个连接元件位于反射器的外周边内。 InFO天线被配置为输出具有波长的信号。
-
公开(公告)号：US20210028811A1
公开(公告)日：2021-01-28
申请号：US17066113
申请日：2020-10-08
发明人： En-Hsiang YEH , Monsen LIU , Chuei-Tang WANG
摘要： A method includes switching a receiver path network of a front-end module to a first matching mode in a receive mode. The method further includes switching a transmitter path network of the front-end module to a first resonance mode in the receive mode. The method further includes switching the transmitter path network to a second matching mode in a transmit mode. The method further includes switching the receiver path network to a second resonance mode in the transmit mode.
-
公开(公告)号：US20200067560A1
公开(公告)日：2020-02-27
申请号：US16665546
申请日：2019-10-28
发明人： En-Hsiang YEH , Monsen LIU , Chuei-Tang WANG
摘要： A method includes (a) switching a receiver path network of a front end module to a first matching mode in a receive mode. The method further includes (b) switching a transmitter path network of the front end module to a first resonance mode in the receive mode. The method further includes (c) switching the transmitter path network to a second matching mode in a transmit mode. The method further includes (d) switching the receiver path network to a second resonance mode in the transmit mode.
-
公开(公告)号：US20180151466A1
公开(公告)日：2018-05-31
申请号：US15658948
申请日：2017-07-25
发明人： Ying-Chih HSU , Alan ROTH , Chuei-Tang WANG , Chih-Yuan CHANG , Eric SOENEN , Chih-Lin CHEN
IPC分类号： H01L23/367 , H01L23/48 , H01L23/498 , H01L21/48
CPC分类号： H01L23/3677 , H01L21/486 , H01L23/481 , H01L23/49822 , H01L2224/18
摘要： A package structure includes a first package layer, a second package layer, and a chip layer positioned between the first package layer and the second package layer. The first package layer includes an electrical signal structure electrically isolated from a first thermal conduction structure. The chip layer includes an integrated circuit (IC) chip electrically connected to the electrical signal structure, a molding material, and a through-via positioned in the molding material. The first thermal conduction structure, the through-via, and the second thermal conduction structure are configured as a low thermal resistance path from the IC chip to a surface of the second package layer opposite the chip layer.
-
5.发明申请公开(公告)号：US20180102595A1
公开(公告)日：2018-04-12
申请号：US15837480
申请日：2017-12-11
发明人： Chuei-Tang WANG , Jeng-Shieh HSIEH , Chung-Hao TSAI , Monsen LIU , Chen-Hua YU
IPC分类号： H01Q21/06 , H01Q1/22 , H01Q19/00 , H01Q19/185 , H01Q19/10
CPC分类号： H01Q21/065 , H01L23/66 , H01L24/20 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01Q1/2283 , H01Q19/005 , H01Q19/10 , H01Q19/185
摘要： A semiconductor device includes an active device. The semiconductor device further includes a plurality of antenna grounds electrically connected to the active device. The semiconductor device further includes a plurality of patch antennas, wherein each patch antenna of the plurality of patch antennas is over a corresponding antenna ground of the plurality of antenna grounds. The semiconductor device further includes a plurality of reflectors, wherein each antenna ground of the plurality of antenna ground is between a corresponding patch antenna of the plurality of patch antennas and a corresponding reflector of the plurality of reflectors. An area of each antenna ground of the plurality of antenna grounds is greater than an area of each reflector of the plurality of reflectors.
-
公开(公告)号：US20160093588A1
公开(公告)日：2016-03-31
申请号：US14496327
申请日：2014-09-25
发明人： Chuei-Tang WANG , Monsen LIU , Sen-Kuei HSU , Chen-Hua YU
IPC分类号： H01L25/065
CPC分类号： H01L23/50 , B23H7/10 , H01L23/49822 , H01L23/49827 , H01L24/18 , H01L25/03 , H01L25/16 , H01L25/18 , H01L2224/16225 , H01L2225/06513 , H01L2225/06541 , H01L2924/15311 , H01L2924/181 , H05K1/181 , H05K2201/10159 , H05K2201/10515 , H01L2924/00012
摘要： A semiconductor device includes a device die, a first power supply die, and a second power supply die different from the first power supply die. The device die includes a first circuit and a second circuit. The first power supply die is electrically coupled to the first circuit and configured to supply power for the first circuit. The second power supply die is electrically coupled to the second circuit and configured to supply power for the second circuit. The first and second power supply dies are attached to the device die, and overlap the device die in a thickness direction of the device die.
摘要翻译： 半导体器件包括与第一电源裸片不同的器件管芯，第一电源管芯和第二电源管芯。 器件裸片包括第一电路和第二电路。 第一电源管芯电耦合到第一电路并且被配置为为第一电路供电。 第二电源裸片电耦合到第二电路并且被配置为为第二电路供电。 第一和第二电源模具附接到器件管芯，并且沿着器件管芯的厚度方向与器件管芯重叠。
-
公开(公告)号：US20190157180A1
公开(公告)日：2019-05-23
申请号：US16204953
申请日：2018-11-29
发明人： Ying-Chih HSU , Alan ROTH , Chuei-Tang WANG , Chih-Yuan CHANG , Eric SOENEN , Chih-Lin CHEN
IPC分类号： H01L23/367 , H01L23/498 , H01L23/48 , H01L21/48
CPC分类号： H01L23/3677 , H01L21/486 , H01L23/481 , H01L23/49822 , H01L23/5389 , H01L2224/18
摘要： An integrated circuit (IC) package structure includes an electrical signal path, a low thermal resistance path and a substrate that includes a first device and a second device. The first device and the second device are part of an IC chip. The electrical signal path is from the first device to a top surface of the IC chip. The low thermal resistance path extends from the second device to the top surface of the IC chip. The low thermal resistance path is electrically isolated from the electrical signal path. The second device is thermally coupled to the first device by a low thermal resistance substrate path.
-
公开(公告)号：US20200176349A1
公开(公告)日：2020-06-04
申请号：US16785248
申请日：2020-02-07
发明人： Ying-Chih HSU , Alan ROTH , Chuei-Tang WANG , Chih-Yuan CHANG , Eric SOENEN , Chih-Lin CHEN
IPC分类号： H01L23/367 , H01L21/48 , H01L23/48 , H01L23/498
摘要： A method of transferring heat in a package includes conducting heat from a first device to a second device by a low thermal resistance substrate path in a chip layer of the package, conducting heat from an integrated circuit (IC) to a first package layer of the package, conducting heat from the first package layer of the package to at least a first set of through-vias positioned in the chip layer, and conducting heat from the first set of through-vias to a surface of a second package layer opposite the chip layer. The first device and the second device is part of the IC chip. The first package layer is adjacent to the chip layer.
-
公开(公告)号：US20150130681A1
公开(公告)日：2015-05-14
申请号：US14075252
申请日：2013-11-08
发明人： Jeng-Shieh HSIEH , Chung-Hao TSAI , Chuei-Tang WANG , Chen-Hua YU
IPC分类号： H01Q1/38 , H01L21/3213 , H01L21/768 , H01Q9/04 , H01Q1/36
CPC分类号： H01Q1/2283 , H01L23/481 , H01L23/49822 , H01L23/5227 , H01L2924/0002 , H01Q1/362 , H01Q1/38 , H01Q1/48 , H01Q9/0421 , H01L2924/00
摘要： An antenna comprises a first layer having a first redistribution layer, a feeding line, a ground connection element, and one or more antenna inputs. The antenna also comprises one or more intermediate layers over the first layer. The antenna further comprises a second layer having a second redistribution layer over the one or more intermediate layers. The antenna additionally comprises one or more through vias arranged to communicatively couple the second redistribution layer and the first redistribution layer. The antenna also comprises a short element. The antenna further comprises one or more radiator antennas within the one or more through vias, the one or more radiator antennas being in communication with the one or more antenna inputs by way of the feeding line.
摘要翻译： 天线包括具有第一再分配层，馈电线，接地连接元件和一个或多个天线输入的第一层。 天线还包括在第一层上的一个或多个中间层。 所述天线还包括在所述一个或多个中间层之上具有第二再分配层的第二层。 天线还包括一个或多个通孔，布置成可通信地耦合第二再分布层和第一再分配层。 该天线还包括一个短元件。 所述天线还包括所述一个或多个通孔内的一个或多个辐射器天线，所述一个或多个辐射器天线通过所述馈电线与所述一个或多个天线输入通信。
-
-
-
-
-
-
-
-
搜索结果
9 条记录 (耗时 0.018 秒)