公开(公告)号：US20180337203A1

公开(公告)日：2018-11-22

申请号：US15597521

申请日：2017-05-17

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Cheng-Yi WU ,  Chun-Chih LIN ,  Jian-Shin TSAI ,  Min-Hui LIN ,  Wen-Shan CHANG ,  Yi-Ming LIN ,  Chao-Ching CHANG ,  C. H. CHEN ,  Chin-Szu LEE ,  Y. T. TSAI

IPC: H01L27/146

Abstract: A method of fabricating an image sensor includes depositing a first dielectric layer over a substrate, removing a portion of the first dielectric layer from the substrate to form a trench, depositing a conductive layer over the first dielectric layer and in the trench, forming a protective layer lining a top surface of the conductive layer and sidewalls and a bottom surface of the groove in the conductive layer, and removing a portion of the conductive layer to form a grid structure. A groove corresponding to the trench is formed in the conductive layer.

公开(公告)号：US20190088692A1

公开(公告)日：2019-03-21

申请号：US16194778

申请日：2018-11-19

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Cheng-Yi WU ,  Chun-Chih LIN ,  Jian-Shin TSAI ,  Min-Hui LIN ,  Wen-Shan CHANG ,  Yi-Ming LIN ,  Chao-Ching CHANG ,  C. H. CHEN ,  Chin-Szu LEE ,  Y. T. TSAI

IPC: H01L27/146

Abstract: An image sensor includes a substrate having a first region and a second region. The image sensor further includes a dielectric layer over the substrate. The image sensor further includes a conductive layer over the dielectric layer, wherein in the first region the conductive layer has a grid shape and in the second region a portion of the conductive layer is concave toward the substrate. The image sensor further includes a protective layer, wherein the protective layer is over the conductive layer in the first region, and over a top surface and along sidewalls of the conductive layer in the second region.