SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20150372142A1

    公开(公告)日:2015-12-24

    申请号:US14311921

    申请日:2014-06-23

    IPC分类号: H01L29/78 H01L29/66

    摘要: A semiconductor device includes a gate structure located on a substrate; and a raised source/drain region adjacent to the gate structure. An interface is between the gate structure and the substrate. The raised source/drain region includes a stressor layer providing strain to a channel under the gate structure; and a silicide layer in the stressor layer. The silicide layer extends from a top surface of the raised source/drain region and ends below the interface by a predetermined depth. The predetermined depth allows the stressor layer to maintain the strain of the channel.

    摘要翻译: 半导体器件包括位于衬底上的栅极结构; 以及与栅极结构相邻的凸起的源极/漏极区域。 界面在栅极结构和衬底之间。 凸起的源极/漏极区域包括向栅极结构下方的沟道施加应力的应力源层; 和应力层中的硅化物层。 硅化物层从升高的源极/漏极区的顶表面延伸并且在界面的下方延伸预定的深度。 预定深度允许应力层维持通道的应变。