公开(公告)号：US20210265414A1

公开(公告)日：2021-08-26

申请号：US17315185

申请日：2021-05-07

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： WEI-CHIEH CHIANG ,  KENG-YU CHOU ,  CHUN-HAO CHUANG ,  WEN-HAU WU ,  JHY-JYI SZE ,  CHIEN-HSIEN TSENG ,  KAZUAKI HASHIMOTO

IPC分类号： H01L27/146

摘要： A BSI image sensor includes a substrate including a front side and a back side opposite to the front side, a pixel sensor disposed in the substrate, and a color filter disposed over the pixel sensor. The pixel sensor includes a plurality of first micro structures disposed over the back side of the substrate. The color filter includes a plurality of second micro structures disposed over the back side of the substrate. The first micro structures are arranged symmetrically to a first axial, and the second micro structures are arranged symmetrically to a second axial.

公开(公告)号：US20210020670A1

公开(公告)日：2021-01-21

申请号：US17039614

申请日：2020-09-30

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： KENG-YU CHOU ,  WEI-CHIEH CHIANG ,  CHEN-JONG WANG ,  CHIEN-HSIEN TSENG ,  KAZUAKI HASHIMOTO

IPC分类号： H01L27/146

摘要： A BSI image sensor includes a substrate including a front side and a back side opposite to the front side, a plurality of pixel sensors, an isolation grid disposed in the substrate and separating the plurality of pixel sensors from each other, a reflective grid disposed over the isolation grid on the back side of the substrate, an a low-n grid disposed over the back side of the substrate and overlapping the reflective grid from a top view. A width of the low-n grid is greater than a width of the reflective grid.

公开(公告)号：US20200091210A1

公开(公告)日：2020-03-19

申请号：US16692468

申请日：2019-11-22

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： WEN-HAU WU ,  KENG-YU CHOU ,  CHUN-HAO CHUANG ,  WEI-CHIEH CHIANG ,  CHIEN-HSIEN TSENG ,  KAZUAKI HASHIMOTO

IPC分类号： H01L27/146

摘要： A BSI image sensor includes a substrate including a front side and a back side opposite to the front side, a pixel sensor disposed in the substrate, an isolation structure surrounding the pixel sensor and disposed in the substrate, a dielectric layer disposed over the pixel sensor on the front side of the substrate, and a plurality of conductive structures disposed in the dielectric layer and arranged to align with the isolation structure.

公开(公告)号：US20190131339A1

公开(公告)日：2019-05-02

申请号：US16101211

申请日：2018-08-10

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： WEI-CHIEH CHIANG ,  KENG-YU CHOU ,  CHUN-HAO CHUANG ,  WEN-HAU WU ,  JHY-JYI SZE ,  CHIEN-HSIEN TSENG ,  KAZUAKI HASHIMOTO

IPC分类号： H01L27/146

CPC分类号： H01L27/14645 ,  H01L27/14621 ,  H01L27/14629 ,  H01L27/1463 ,  H01L27/14632 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/14689

摘要： A BSI image sensor includes a substrate including a front side and a back side opposite to the front side, a pixel sensor disposed in the substrate, and a color filter disposed over the pixel sensor. The pixel sensor includes a plurality of first micro structures disposed over the back side of the substrate, and the color filter includes a plurality of second micro structures disposed over the back side of the substrate.

公开(公告)号：US20190131327A1

公开(公告)日：2019-05-02

申请号：US15928748

申请日：2018-03-22

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： KENG-YU CHOU ,  WEI-CHIEH CHIANG ,  CHEN-JONG WANG ,  CHIEN-HSIEN TSENG ,  KAZUAKI HASHIMOTO

IPC分类号： H01L27/146

摘要： A BSI image sensor includes a substrate including a front side and a back side opposite to the front side, a plurality of pixel sensors arranged in an array, an isolation grid disposed in the substrate and separating the plurality of pixel sensors from each other, and a reflective grid disposed over the isolation grid on the back side of the substrate. A depth of the reflective grid is less than a depth of the isolation grid.

公开(公告)号：US20190096930A1

公开(公告)日：2019-03-28

申请号：US15873355

申请日：2018-01-17

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： CHUN-HAO CHUANG ,  KENG-YU CHOU ,  WEN-HAU WU ,  WEI-CHIEH CHIANG ,  CHIEN-HSIEN TSENG ,  KAZUAKI HASHIMOTO

IPC分类号： H01L27/146

摘要： A BSI image sensor includes a substrate including a front side and a back side opposite to the front side, and a plurality of pixel sensors arranged in an array. Each of the pixel sensors includes a photo-sensing device in the substrate, a color filter over the pixel sensor on the back side, and an optical structure over the color filter on the back side. The optical structure includes a first sidewall, and the first sidewall and a plane substantially parallel with a front surface of the substrate form an included angel greater than 0°.