公开(公告)号：US11897759B2

公开(公告)日：2024-02-13

申请号：US17838023

申请日：2022-06-10

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Po Chen Yeh ,  Yi-Hsien Chang ,  Fu-Chun Huang ,  Ching-Hui Lin ,  Chiahung Liu ,  Shih-Fen Huang ,  Chun-Ren Cheng

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81C1/00301 ,  B81B2201/0271 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/097 ,  B81C2203/0792

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first device and a second device disposed adjacent to the first device; a conductive pillar disposed adjacent to the first device or the second device; a molding surrounding the first device, the second device and the conductive pillar; and a redistribution layer (RDL) over the first device, the second device, the molding and the conductive pillar, wherein the RDL electrically connects the first device to the second device and includes an opening penetrating the RDL and exposing a sensing area over the first device.

公开(公告)号：US12227410B2

公开(公告)日：2025-02-18

申请号：US18404922

申请日：2024-01-05

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Po Chen Yeh ,  Yi-Hsien Chang ,  Fu-Chun Huang ,  Ching-Hui Lin ,  Chiahung Liu ,  Shih-Fen Huang ,  Chun-Ren Cheng

IPC: B81B7/00 ,  B81C1/00

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first device and a second device disposed adjacent to the first device; a conductive pillar disposed adjacent to the first device or the second device; a molding surrounding the first device, the second device and the conductive pillar; and a redistribution layer (RDL) over the first device, the second device, the molding and the conductive pillar, wherein the RDL electrically connects the first device to the second device and includes an opening penetrating the RDL and exposing a sensing area over the first device.