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公开(公告)号：US20210265979A1
公开(公告)日：2021-08-26
申请号：US17172431
申请日：2021-02-10
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Makoto INOUE , Hideyuki SEKINE
Abstract: A filter includes first and second signal terminals, a filter circuit connected between the first and second signal terminals, a substrate having first and second surfaces, the first and second signal terminals being located on the first surface, a part of the filter circuit being located at a side of the second surface, a line located closer to the first surface than the filter circuit in the substrate, a first end of the line being connected to one of the first and second signal terminals, and a ground terminal that is located on the first surface and to which a second end of the line is connected, an area of a region where the line overlaps with the ground terminal being greater than an area of a region where the line overlaps with the one of the first and second signal terminals when the substrate is viewed in plan view.
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公开(公告)号：US20200235714A1
公开(公告)日：2020-07-23
申请号：US16719260
申请日：2019-12-18
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Jaeho JEONG , Shuei HASHIMOTO , Naoyuki TASAKA , Sachiko TANAKA , Makoto INOUE
IPC: H03H7/01
Abstract: A filter includes: a substrate; input and output terminals located on the substrate; a resonant circuit located in a series pathway between the input and output terminals; a first component including a first inductor, which is electrically connected between a first node in the series pathway and a ground, and mounted in a first region on the substrate; a second component including a second inductor, which is electrically connected between a second node different from the first node in the series pathway and a ground, and mounted in a second region different from the first region on the substrate; and a third component including an acoustic wave resonator, which is electrically connected between a third node between the first and second nodes in the series pathway and a ground, and mounted in a third region between the first and second regions on the substrate.
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Patent Agency Ranking
公开(公告)号：US20180226952A1
公开(公告)日：2018-08-09
申请号：US15868228
申请日：2018-01-11
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Sachiko TANAKA , Makoto INOUE , Naoyuki TASAKA
Abstract: A filter circuit includes: a first element that is a first capacitor or a first inductor connected in series between input and output terminals; a second element that is connected in parallel to the first element between the input and output terminals, is a second inductor when the first element is the first capacitor, and is a second capacitor when the first element is the first inductor; a third element that is connected in parallel to the first element and in series with the second element between the input and output terminals, is a third inductor when the first element is the first capacitor, and is a third capacitor when the first element is the first inductor; and an acoustic wave resonator having a first end coupled to a first node between the second element and the third element and a second end coupled to a ground terminal.
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公开(公告)号：US20140364070A1
公开(公告)日：2014-12-11
申请号：US14102322
申请日：2013-12-10
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Hirotaka TAKEUCHI , Makoto INOUE , Takashi AMANO
IPC: H04B7/12
CPC classification number: H04B1/0064
Abstract: Electrodes are formed of a nonmagnetic metal in high-frequency electronic components that conduct high frequency electric current having a frequency included in any of a first frequency band for transmitting and a third frequency band for receiving, both assigned to a first transmitting/receiving unit for data communication, and a second frequency band for transmitting and a fourth frequency band for receiving, both assigned to a second transmitting/receiving unit for telephone communication. The high-frequency electronic components also restrict the frequency of the conducted electric current.
Abstract translation: 电极由高频电子部件中的非磁性金属形成，该高频电子部件进行包含在用于发送的第一频带中的任一个中的频率的高频电流和用于接收的第三频带，两者分配给第一发送/接收单元 数据通信以及用于发送的第二频带和用于接收的第四频带，两者分配给用于电话通信的第二发送/接收单元。 高频电子元件也限制了传导电流的频率。
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公开(公告)号：US20220416763A1
公开(公告)日：2022-12-29
申请号：US17847565
申请日：2022-06-23
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Makoto INOUE , Naoto KOBAYASHI , Hideyuki SEKINE , Jaeho JEONG
Abstract: A filter includes an input terminal, an output terminal, a ground terminal, a first capacitor and a second capacitor that are connected in series between the input terminal and the output terminal, a capacitive element that is connected in parallel to the first capacitor and the second capacitor between the input terminal and the output terminal, and has a Q factor that is smaller than a Q factor of the first capacitor and is smaller than a Q factor of the second capacitor, and an inductor that has a first end and a second end, the first end being coupled to a node that is provided between the first capacitor and the second capacitor and that is coupled to the capacitive element through the first capacitor and the second capacitor, the second end being coupled to the ground terminal.
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公开(公告)号：US20220416746A1
公开(公告)日：2022-12-29
申请号：US17847522
申请日：2022-06-23
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Makoto INOUE , Jaeho JEONG , Hideyuki SEKINE , Naoto KOBAYASHI
Abstract: A filter includes an input terminal, an output terminal, a first ground terminal, a second ground terminal, a first inductor having a first end coupled to a first node in a path between the input terminal and the output terminal and a second end coupled to a second node, a second inductor having a first end coupled to the second node and a second end coupled to the first ground terminal, and a third inductor having a first end coupled to the second node and a second end coupled to the second ground terminal.
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公开(公告)号：US20200252044A1
公开(公告)日：2020-08-06
申请号：US16721268
申请日：2019-12-19
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Hideyuki SEKINE , Hosung CHOO , Makoto INOUE
IPC: H03H9/05 , H05K1/11 , H05K1/16 , H03H9/64 , H05K1/02 , H03H9/72 , H03H3/08 , H05K3/34 , H05K3/40 , H05K3/36
Abstract: A high-frequency device includes: a circuit substrate including dielectric layers that are stacked, wiring patterns located on at least one of the dielectric layers, and a passive element formed of at least one of the wiring patterns, the circuit substrate having a first surface that is a surface of an outermost dielectric layer in a stacking direction of the dielectric layers; a terminal for connecting the high-frequency device to an external circuit, the terminal being located on the first surface and electrically connected to the passive element through a first path in the circuit substrate; and an acoustic wave element located on the first surface and electrically connected to the passive element through a second path in the circuit substrate.
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