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公开(公告)号：US09358612B2
公开(公告)日：2016-06-07
申请号：US14330775
申请日：2014-07-14
发明人： Takanobu Miyashita , Yasuyuki Goto , Takamichi Yamamoto , Ryousuke Kushibiki , Masahiro Aono , Masahiro Nishiura
IPC分类号： C23C14/24 , B22F3/12 , B22F9/08 , C23C14/34 , C22C1/05 , C22C5/04 , C22C32/00 , G11B5/851 , B22F9/04 , C22C1/04 , C22C1/10 , H01J37/34 , C23C14/06 , C22C38/00 , C22C38/16
CPC分类号： B22F3/12 , B22F9/04 , B22F9/08 , B22F9/082 , B22F2201/03 , B22F2999/00 , C22C1/0466 , C22C1/05 , C22C1/10 , C22C5/04 , C22C32/00 , C22C38/002 , C22C38/16 , C23C14/0635 , C23C14/34 , C23C14/3414 , G11B5/851 , H01J37/3429 , H01J37/3491 , H01J2237/3322 , H01J2237/3323
摘要： An FePt-based sputtering target contains Fe, Pt, and a metal oxide, and further contains one or more kinds of metal elements other than Fe and Pt, wherein the FePt-based sputtering target has a structure in which an FePt-based alloy phase and a metal oxide phase containing unavoidable impurities are mutually dispersed, the FePt-based alloy phase containing Pt in an amount of 40 at % or more and less than 60 at % and the one or more kinds of metal elements in an amount of more than 0 at % and 20 at % or less with the balance being Fe and unavoidable impurities and with the total amount of Pt and the one or more kinds of metal elements being 60 at % or less, and wherein the metal oxide is contained in an amount of 20 vol % or more and 40 vol % or less based on the total amount of the target.
摘要翻译： FePt系溅射靶包含Fe，Pt和金属氧化物，并且还含有除Fe和Pt以外的一种以上的金属元素，其中，FePt系溅射靶具有FePt系合金相 含有不可避免的杂质的金属氧化物相相互分散，含有40at％以上且小于60at％的Pt的FePt系合金相和超过一个以上的金属元素 0原子％和20原子％以下，余量为Fe和不可避免的杂质，Pt的总量和一种或多种金属元素的含量为60原子％以下，其中金属氧化物的含量 为20体积％以上且40体积％以下。
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公开(公告)号：US09928996B2
公开(公告)日：2018-03-27
申请号：US14313787
申请日：2014-06-24
发明人： Takanobu Miyashita , Yasuyuki Goto
IPC分类号： B22F3/12 , H01J37/34 , C22C19/05 , C22C38/30 , C22C19/07 , C22C32/00 , C23C14/34 , G11B5/851 , H01F41/18 , C22C1/04 , B22F1/02
CPC分类号： H01J37/3426 , B22F1/02 , B22F3/12 , C22C1/0433 , C22C19/05 , C22C19/07 , C22C32/0026 , C22C38/30 , C22C2202/02 , C23C14/3407 , C23C14/3414 , G11B5/851 , H01F41/183
摘要： A process for producing a magnetron sputtering target includes: mixing and dispersing an oxide powder and a magnetic metal powder, the magnetic metal powder containing a ferromagnetic metal element, to obtain a magnetic powder mixture; mixing and dispersing an oxide powder and each of a plurality of non-magnetic metal powders, the plurality of non-magnetic metal powders containing the ferromagnetic metal element, the plurality of non-magnetic metal powders containing a different constituent element from each other or containing constituent elements at different ratios from each other, to obtain a plurality of non-magnetic powder mixtures; and mixing and dispersing the magnetic powder mixture and the plurality of non-magnetic powder mixtures to obtain a powder mixture for pressure sintering.
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公开(公告)号：US09314846B2
公开(公告)日：2016-04-19
申请号：US14330786
申请日：2014-07-14
发明人： Takanobu Miyashita , Yasuyuki Goto , Takamichi Yamamoto , Ryousuke Kushibiki , Masahiro Aono , Masahiro Nishiura
IPC分类号： B22F3/12 , B22F9/08 , C23C14/34 , C22C1/05 , C22C5/04 , C22C32/00 , G11B5/851 , B22F9/04 , C22C1/04 , C22C1/10 , H01J37/34 , C23C14/06 , C22C38/00 , C22C38/16
CPC分类号： B22F3/12 , B22F9/04 , B22F9/08 , B22F9/082 , B22F2201/03 , B22F2999/00 , C22C1/0466 , C22C1/05 , C22C1/10 , C22C5/04 , C22C32/00 , C22C38/002 , C22C38/16 , C23C14/0635 , C23C14/34 , C23C14/3414 , G11B5/851 , H01J37/3429 , H01J37/3491 , H01J2237/3322 , H01J2237/3323
摘要： A process for producing an FePt-based sputtering target includes adding metal oxide powder containing unavoidable impurities to FePt-based alloy powder containing Pt in an amount of 40 at % or more and less than 60 at % and one or more kinds of metal elements other than Fe and Pt in an amount of more than 0 at % and 20 at % or less with the balance being Fe and unavoidable impurities and with a total amount of Pt and the one or more kinds of metal elements being 60 at % or less so that the metal oxide powder accounts for 20 vol % or more and 40 vol % or less of a total amount of the FePt-based alloy powder and the metal oxide powder, followed by mixing the FePt-based alloy powder and the metal oxide powder to produce a powder mixture.
摘要翻译： 一种FePt系溅射靶的制造方法，其特征在于，在含有40质量％以上且小于等于60原子％的Pt的FePt系合金粉末中添加含有不可避免的杂质的金属氧化物粉末和其他金属元素 比Fe和Pt大于0at％和20at％或更少，余量为Fe和不可避免的杂质，并且Pt的总量和一种或多种金属元素的含量为60原子％以下，Fe 金属氧化物粉末占FePt系合金粉末和金属氧化物粉末总量的20体积％以上且40体积％以下，然后将FePt系合金粉末和金属氧化物粉末混合到 产生粉末混合物。
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公开(公告)号：US20210032741A1
公开(公告)日：2021-02-04
申请号：US16982375
申请日：2019-03-18
发明人： Masahiro Nishiura , Takamichi Yamamoto , Kenta Kurose , Hironori Kobayashi , Takanobu Miyashita
摘要： Provided is an Fe—Pt-oxide-BN-based sintered compact for a high-density sputtering target that can suppress generation of particles during sputtering.
The Fe—Pt-oxide-BN-based sintered compact for a sputtering target has a mass ratio of N to B (N/B) in a range of 1.30±0.1.-
公开(公告)号：US09228255B2
公开(公告)日：2016-01-05
申请号：US14311934
申请日：2014-06-23
CPC分类号： C23C14/3414 , B22F2998/10 , B22F2999/00 , C22C1/0466 , C22C5/04 , C22C33/0278 , C22C1/05 , B22F3/12 , B22F2201/03 , B22F1/0003 , B22F3/14
摘要： An FePt—C-based sputtering target contains Fe, Pt, and C and has a structure in which an FePt-based alloy phase and a C phase containing unavoidable impurities are mutually dispersed, the FePt-based alloy phase containing Pt in an amount of 40 at % or more and 60 at % or less with the balance being Fe and unavoidable impurities. The content of C is 21 at % or more and 70 at % or less based on the total amount of the target.
摘要翻译： FePt-C系的溅射靶含有Fe，Pt，C，具有FePt系合金相和含有不可避免的杂质的C相相互分散的结构，含有Pt量的FePt系合金相 40原子％以上且60原子％以下，余量为Fe和不可避免的杂质。 C的含量相对于靶的总量为21原子％以上且70原子％以下。
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公开(公告)号：US20220356557A1
公开(公告)日：2022-11-10
申请号：US17623511
申请日：2020-04-07
发明人： Takamichi Yamamoto , Masahiro Nishiura , Kenta Kurose , Hironori Kobayashi , Takanobu Miyashita , Tomoko Matsuda
摘要： Provided is an Fe—Pt—BN-based sputtering target that has a high relative density and that suppresses particle generation.
The Fe—Pt—BN-based sputtering target has, as a residue after dissolution in aqua regia measured by a procedure below, the particle size distribution in which D90 is 5.5 μm or less and a proportion of fine particles smaller than 1 μm is 35% or less. The procedure includes: (1) cutting out an about 4 mm-square sample piece from the sputtering target, followed by pulverizing to prepare a pulverized product; (2) classifying the pulverized product using sieves of 106 μm and 300 μm in opening size and collecting a powder that has passed through the 300 μm sieve and remained on the 106 μm sieve; (3) immersing the powder in aqua regia heated to 200° C. to prepare a residue-containing solution in which the powder has been dissolved; (4) filtering the residue-containing solution through a 5A filter paper specified in JIS P 3801 and drying a residue on the filter paper at 80° C. to prepare a residue powder; (5) dispersing the residue powder in water containing a surfactant to prepare a sample solution; and (6) setting the sample solution in a particle size analyzer and measuring the particle size distribution.-
公开(公告)号：US20220267892A1
公开(公告)日：2022-08-25
申请号：US17626394
申请日：2020-05-22
发明人： Masahiro Nishiura , Takamichi Yamamoto , Kenta Kurose , Hironori Kobayashi , Takanobu Miyashita
摘要： A problem of particle generation in an Fe-Pt-BN-based sputtering target having a high relative density is resolved by an approach different from conventional methods.
An Fe-Pt-BN-based sputtering target having a relative density of 90% or more and a Vickers hardness of 150 or less can reduce the number of particles generated during magnetron sputtering.-
公开(公告)号：US09314845B2
公开(公告)日：2016-04-19
申请号：US14328106
申请日：2014-07-10
发明人： Takanobu Miyashita , Yasuyuki Goto , Takamichi Yamamoto , Ryousuke Kushibiki , Masahiro Aono , Masahiro Nishiura
IPC分类号： C23C14/24 , B22F3/12 , B22F9/08 , C23C14/34 , C22C1/05 , C22C5/04 , C22C32/00 , G11B5/851 , B22F9/04 , C22C1/04 , C22C1/10 , H01J37/34 , C23C14/06 , C22C38/00 , C22C38/16
CPC分类号： B22F3/12 , B22F9/04 , B22F9/08 , B22F9/082 , B22F2201/03 , B22F2999/00 , C22C1/0466 , C22C1/05 , C22C1/10 , C22C5/04 , C22C32/00 , C22C38/002 , C22C38/16 , C23C14/0635 , C23C14/34 , C23C14/3414 , G11B5/851 , H01J37/3429 , H01J37/3491 , H01J2237/3322 , H01J2237/3323
摘要： A process for producing an FePt-based sputtering target includes adding C powder containing unavoidable impurities and metal oxide powder containing unavoidable impurities to FePt-based alloy powder containing Pt in an amount of 40 at % or more and 60 at % or less with the balance being Fe and unavoidable impurities so that the C powder and the metal oxide powder are contained to satisfy: 0
摘要翻译： 制造FePt系溅射靶的方法包括将含有不可避免的杂质的C粉末和含有不可避免的杂质的金属氧化物粉末添加至含有40质量％以上且60原子％以下的Pt的FePt系合金粉末，余量 是Fe和不可避免的杂质，因此含有C粉末和金属氧化物粉末以满足：0 <α＆nlE; 20; 10＆nlE;＆bgr; <40; 和20＆nlE;α+＆bgr;＆nlE; 40，其中α和＆bgr; 基于FePt系合金粉末，C粉末和金属氧化物粉末的总量，分别以体积％表示C粉末和金属氧化物粉末的含量，然后将FePt系合金粉末， C粉末和金属氧化物粉末以产生粉末混合物。
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公开(公告)号：US20140311901A1
公开(公告)日：2014-10-23
申请号：US14357852
申请日：2012-10-12
发明人： Takanobu Miyashita , Yasuyuki Goto
IPC分类号： H01J37/34
CPC分类号： H01J37/3429 , B22F3/00 , B22F3/14 , C22C1/04 , C22C1/0433 , C22C1/05 , C22C5/04 , C22C19/07 , C22C27/06 , C22C30/00 , C23C14/3414 , G11B5/851 , H01F41/183 , H01J37/3426
摘要： Provided is a magnetron sputtering target having a ferromagnetic metal element. This magnetron sputtering target includes: a magnetic phase containing the ferromagnetic metal element; a plurality of non-magnetic phases that each contain the ferromagnetic metal element and that are different in constituent elements or a content ratio of constituent elements; and an oxide phase. At least one of the plurality of non-magnetic phases is more finely interdispersed with the oxide phase than the magnetic phase.
摘要翻译： 提供了具有铁磁性金属元素的磁控溅射靶。 该磁控溅射靶包括：含有铁磁性金属元素的磁性相; 多个非磁性相，其各自含有强磁性金属元素，并且构成元素不同或构成元素的含量比; 和氧化物相。 所述多个非磁性相中的至少一个与所述磁性相相比，所述氧化物相更细微地分散。
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公开(公告)号：US20210040602A1
公开(公告)日：2021-02-11
申请号：US17044687
申请日：2019-04-22
发明人： Takamichi Yamamoto , Masahiro Nishiura , Kenta Kurose , Hironori Kobayashi , Takanobu Miyashita , Masahumi Nakano
摘要： A sputtering target with suppressed aggregation of C particles and reduced generation of particles is provided.
A C-containing sputtering target comprises Pt, C, and one or more selected from Fe and Co, where in a particle size distribution of a dissolution residue of the sputtering target, 90 percentile of the particle diameter based on the volume, D90 is 20.0 μm or less, and particle size of less than 1.0 μm accounts for 40% or less in cumulative volume distribution.
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