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公开(公告)号:US20240015891A1
公开(公告)日:2024-01-11
申请号:US17618487
申请日:2021-11-05
Inventor: Tong Deng
CPC classification number: H05K3/108 , H05K3/125 , H05K3/1283 , H05K1/028 , H05K3/303 , H05K2203/0186 , H05K2203/0264 , H05K2203/0502 , H05K2201/10128
Abstract: A method of manufacturing circuits of a substrate of a display device is provided. The method includes aligning and attaching a mask with multiple slots to a circuit area of the substrate; printing a printing material in the slots of the mask using an inkjet printing technology, so that the printing material is attached to the circuit area; removing the mask from the substrate; and curing the printing material on the circuit area to form a plurality of the circuits.
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公开(公告)号:US11892674B2
公开(公告)日:2024-02-06
申请号:US17621716
申请日:2021-12-10
Inventor: Tong Deng
IPC: F21V8/00
CPC classification number: G02B6/0055 , G02B6/0038 , G02B6/0065
Abstract: A production method of a backlight plate, a backlight plate and a backlight module are provided. The method includes providing a light-transmitting substrate which comprises a first area and a second area, forming a pad on the light-transmitting underlay substrate corresponding to the first area, coating a layer of photosensitive material on the light-transmitting substrate and the pad to form a reflective layer, exposing a position of the second area at opposite sides of the light-transmitting substrate that the reflective layer corresponds to, and developing the reflective layer to form a groove for exposing the pad on the first area that the reflective layer corresponds to. The present disclosure ensures the stability of the reflective layer and enhances the overall reflectance of the backlight plate.
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公开(公告)号:US12295106B2
公开(公告)日:2025-05-06
申请号:US17618487
申请日:2021-11-05
Inventor: Tong Deng
Abstract: A method of manufacturing circuits of a substrate of a display device is provided. The method includes aligning and attaching a mask with multiple slots to a circuit area of the substrate; printing a printing material in the slots of the mask using an inkjet printing technology, so that the printing material is attached to the circuit area; removing the mask from the substrate; and curing the printing material on the circuit area to form a plurality of the circuits.
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