MULTILAYER ELECTRONIC COMPONENT
    1.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 有权
    多层电子元件

    公开(公告)号:US20170076870A1

    公开(公告)日:2017-03-16

    申请号:US15265129

    申请日:2016-09-14

    CPC classification number: H01G4/30 H01G4/12 H01G4/224 H01G4/232

    Abstract: A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. The insulating layer integrally has an insulating layer extension portion covering part of the end surfaces facing each other in the second axis direction. W1/W0 is 1/30 to less than ⅜, where W0 denotes a width along the first axis, and W1 denotes a width along the first axis of the insulating layer extension portion. The external electrode covers at least part of the insulating layer extension portion.

    Abstract translation: 多层电子部件包括具有内部电极层和电介质层的元件体。 这些基本平行于包括第一轴和第二轴的平面,并且沿着第三轴线交替地层叠。 在第一轴线方向上彼此相对的侧表面分别装有绝缘层。 在第二轴方向上彼此面对的端面分别配备有外部电极。 绝缘层一体地具有绝缘层延伸部,该绝缘层延伸部覆盖在第二轴线方向上彼此面对的端面的一部分。 W1 / W0为1/30至小于⅜,其中W0表示沿着第一轴的宽度,W1表示沿绝缘层延伸部的第一轴的宽度。 外部电极覆盖绝缘层延伸部分的至少一部分。

    MULTILAYER ELECTRONIC COMPONENT
    2.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 有权
    多层电子元件

    公开(公告)号:US20170076867A1

    公开(公告)日:2017-03-16

    申请号:US15265268

    申请日:2016-09-14

    CPC classification number: H01G4/30 H01G4/012 H01G4/12 H01G4/232 H01G4/242

    Abstract: A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These layers are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. A pair of side surfaces facing each other in the first axis direction of the element body is respectively equipped with an insulating layer. A pair of end surfaces facing each other in the second axis direction of the element body is respectively equipped with an external electrode electrically connected to the internal electrode layer. The insulating layer has a mountain portion formed on a peripheral edge of the side surface and a plane portion of a central portion of the side surface.

    Abstract translation: 多层电子部件包括具有内部电极层和电介质层的元件体。 这些层基本上平行于包括第一轴和第二轴的平面,并且沿着第三轴线交替地层叠。 在元件主体的第一轴线方向上彼此面对的一对侧表面分别配备有绝缘层。 在元件主体的第二轴线方向上彼此面对的一对端面分别配备有电连接到内部电极层的外部电极。 绝缘层具有形成在侧面的周缘部和侧面的中央部的平面部的山部。

    MULTILAYER ELECTRONIC COMPONENT
    3.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 有权
    多层电子元件

    公开(公告)号:US20170076864A1

    公开(公告)日:2017-03-16

    申请号:US15264190

    申请日:2016-09-13

    CPC classification number: H01G4/30 H01G4/12 H01G4/224 H01G4/232 H01G4/35

    Abstract: A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. An elastic modulus of the insulating layer is 12 GPa to 140 GPa.

    Abstract translation: 多层电子部件包括具有内部电极层和电介质层的元件体。 这些基本平行于包括第一轴和第二轴的平面,并且沿着第三轴线方向交替地层叠。 在第一轴线方向上彼此相对的侧表面分别装有绝缘层。 在第二轴方向上彼此面对的端面分别配备有外部电极。 绝缘层的弹性模量为12GPa至140GPa。

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