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    MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE OF MULTILAYER CERAMIC CAPACITOR
    1.
    发明公开
    MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE OF MULTILAYER CERAMIC CAPACITOR 审中-公开

    公开(公告)号：US20230343521A1

    公开(公告)日：2023-10-26

    申请号：US18116986

    申请日：2023-03-03

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Tomohiro SASAKI

    IPC分类号： H01G4/30 ,  H01G4/12 ,  H01G4/005

    CPC分类号： H01G4/306 ,  H01G4/12 ,  H01G4/005

    摘要： A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers, first and second main surfaces facing each other in a stacking direction, first and second side surfaces facing each other in a width direction perpendicular or substantially perpendicular to the stacking direction, and first and second end surfaces facing each other in a length direction perpendicular or substantially perpendicular to the stacking and width directions, a first external electrode on the first end surface, a second external electrode on the second end surface, a third external electrode on the first side surface, and a fourth external electrode on the second side surface. A first internal electrode layer is exposed at the first and second end surfaces, and a second internal electrode layer is exposed at the first and second side surfaces and is within a range from the second main surface to ⅓ of the multilayer body in the stacking direction.

    FILM CAPACITOR, CONNECTED CAPACITOR, INVERTER, AND ELECTRIC VEHICLE
    2.
    发明公开
    FILM CAPACITOR, CONNECTED CAPACITOR, INVERTER, AND ELECTRIC VEHICLE 审中-公开

    公开(公告)号：US20230274888A1

    公开(公告)日：2023-08-31

    申请号：US18007238

    申请日：2022-07-01

    申请人： KYOCERA Corporation

    发明人： Kazuki IMAGAWA ,  Naoki KIKUCHI ,  Yuki SENOO ,  Nobuhiro KOBAYASHI

    IPC分类号： H01G4/30 ,  H01G4/14 ,  H01G4/38 ,  H02P27/06 ,  B60L50/60

    CPC分类号： H01G4/306 ,  H01G4/14 ,  H01G4/38 ,  H02P27/06 ,  B60L50/60 ,  B60L2210/40

    摘要： A film capacitor includes a stack including at least one dielectric film and a plurality of metal films, the at least one dielectric film including a polyarylate film, wherein each of the at least one of dielectric film and each of the plurality of metal films are alternately stacked in a stacking direction, each of the plurality of metal films deposited on each of the at least one dielectric film by vapor deposition, cover films on two first side surfaces, the two first side surfaces facing each other in a first direction, the first direction orthogonal to the stacking direction, the cover films containing a polyester hot-melt resin, and metal-sprayed electrodes on two second side surfaces, the two second side surfaces facing each other in a second direction, the second direction perpendicular to the first direction and orthogonal to the stacking direction.

    MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD
    3.
    发明公开
    MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD 审中-公开

    公开(公告)号：US20230268132A1

    公开(公告)日：2023-08-24

    申请号：US18169612

    申请日：2023-02-15

    申请人： TAIYO YUDEN CO., LTD.

    发明人： Shigeto TAKEI ,  Takashi SASAKI

    IPC分类号： H01G4/30 ,  H01G4/232 ,  H01G4/12

    CPC分类号： H01G4/306 ,  H01G4/232 ,  H01G4/302 ,  H01G4/1209

    摘要： A multilayer ceramic capacitor includes a ceramic body and first to fourth external electrodes. The ceramic body has first to fourth side surfaces, first to fourth ridges connecting the two side surfaces, and first and second internal electrodes. External electrodes cover the respective ridges and are connected to internal electrodes. The multilayer ceramic capacitor has a height dimension T of 110 μm or less, and a ratio of a width dimension W to a length dimension L of 0.5 or more and less than 0.85. The internal electrodes extend obliquely outward relative to the X-axis and Y-axis directions from the facing portions, and have lead-out portions towards the ridges.

    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE ELECTRONIC COMPONENT
    5.
    发明公开
    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20230215656A1

    公开(公告)日：2023-07-06

    申请号：US18119619

    申请日：2023-03-09

    申请人： Murata Manufacturing Co., Ltd.

    发明人： Yasuhiro NISHISAKA ,  Mitsuru IKEDA

    IPC分类号： H01G4/30 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232

    CPC分类号： H01G4/306 ,  H01G4/008 ,  H01G4/1272 ,  H01G4/2325

    摘要： An electronic component includes a multilayer body including a multilayer main body including end surfaces at which internal nickel electrode layers are exposed, side gap portions, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering the end surfaces on which the external nickel layers are provided. A nickel-based oxide and/or a silicon-based oxide are provided between the external nickel layer and the external copper electrode layer. A nickel layer and a tin layer are provided outside the external copper electrode layer. In a cross section passing through a middle of the electronic component in the width direction and extending in the length direction and the lamination direction, a relationship of about 0.2≤Tea/Tem≤about 1.1 is satisfied.