公开(公告)号：US11780767B2

公开(公告)日：2023-10-10

申请号：US16923552

申请日：2020-07-08

Applicant: TDK CORPORATION

Inventor： Shin Takane ,  Yousuke Futamata ,  Kenichi Sakai ,  Yasuharu Miyauchi

IPC: C03C10/00 ,  H01L23/15 ,  H05K1/03 ,  B32B17/06 ,  H05K1/02

CPC classification number: C03C10/0009 ,  B32B17/06 ,  C03C10/0036 ,  C03C10/0045 ,  H01L23/15 ,  H05K1/0306 ,  B32B2307/206 ,  B32B2315/08 ,  B32B2457/08 ,  C03C2204/00 ,  H05K1/0298

Abstract: A glass ceramic sintered body having a small dielectric loss in a high frequency band of 10 GHz or higher and a wiring substrate using the same are provided. The glass ceramic sintered body contains crystallized glass, an alumina filler, and silica. The content of the crystallized glass is 45 mass % to 85 mass %, the content of the alumina filler is 14.8 mass % to 50.1 mass % in terms of Al2O3, and the content of silica is 0.2 mass % to 4.9 mass % in terms of SiO2.