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公开(公告)号：US20240332055A1
公开(公告)日：2024-10-03
申请号：US18607902
申请日：2024-03-18
发明人： Gerardo Pantoja
IPC分类号： H01L21/683 , B32B3/04 , B32B7/06 , B32B7/14 , B32B15/04 , B32B15/20 , B32B27/06 , B32B37/12 , B32B37/18 , H01L21/67 , H01L23/31 , H01L23/495
CPC分类号： H01L21/6835 , B32B3/04 , B32B7/06 , B32B7/14 , B32B15/04 , B32B15/20 , B32B27/06 , B32B37/1292 , B32B37/18 , H01L21/67132 , H01L23/3107 , H01L23/495 , B32B2307/206 , B32B2307/7376 , B32B2307/748 , B32B2457/14
摘要： A semiconductor device includes: at least one power semiconductor die; a substrate having a first side and an opposite second side, the at least one power semiconductor die being arranged over the first side; an encapsulation encapsulating the at least one power semiconductor die; a pre-cured lamination layer covering the second side of the substrate, the pre-cured lamination layer being exposed from the encapsulation and configured to provide electrical insulation for the substrate after curing; and a detachable foil covering the pre-cured lamination layer, the detachable foil being configured to be removed from the pre-cured lamination layer.
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公开(公告)号：US20240307219A1
公开(公告)日：2024-09-19
申请号：US18606727
申请日：2024-03-15
CPC分类号： A61F7/02 , A61B5/1036 , A61B5/447 , A61B5/6892 , B32B3/04 , B32B5/026 , D04B1/14 , D04B21/14 , A61B2505/05 , A61F2007/0071 , A61F2007/0093 , A61F2007/0253 , A61F2007/0257 , A61F2007/0288 , B32B2307/202 , B32B2307/206 , B32B2307/304 , B32B2307/7265 , B32B2535/00 , D10B2401/04 , D10B2401/16 , D10B2509/00
摘要： A multi-layer pad for monitoring a patient includes first and second knitted fabric layers. The first knitted fabric layer includes first and second non-conductive bands and a first conductive strip that extend in a first direction. The first conductive strip is between the first and second non-conductive bands and is in contact with a power source. The second knitted fabric layer includes third and fourth non-conductive bands and a second conductive strip that extend in a second direction. The second conductive strip is between the third and fourth non-conductive bands and is in contact with the power source. A spacer is between the first and second knitted fabric layers. An impermeable cover layer encompasses the knitted fabric layers and the spacer. Upon application of force to the multi-layer pad, the first conductive strip is configured to move into close proximity with the second conductive strip and complete an electrical circuit.
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公开(公告)号：US20240300231A1
公开(公告)日：2024-09-12
申请号：US18264011
申请日：2022-02-10
IPC分类号： B32B29/06
CPC分类号： B32B29/06 , B32B2260/028 , B32B2260/046 , B32B2264/10 , B32B2307/206 , B32B2307/75
摘要： A sheet assembly can be cut into one or more cards. The sheet assembly includes an upper layer configured to receive a first printing of first indicia for the one or more cards. The sheet assembly may further include a core coupled with the upper layer and a lower layer configured to receive a second printing of second indicia for the one or more cards. The lower layer is coupled with the core with the core disposed between the upper sheet and the lower sheet. One or more of the upper layer, the core, or the lower layer is formed from paper impregnated with a resin that includes a biobased resin.
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公开(公告)号：US12043016B2
公开(公告)日：2024-07-23
申请号：US16705075
申请日：2019-12-05
IPC分类号： B32B37/12 , B32B3/26 , B32B7/14 , B32B37/18 , C09J5/06 , C09J7/35 , C09J9/02 , C09J163/00 , C09J183/04 , H01L23/00 , H01L27/146
CPC分类号： B32B37/1292 , B32B3/266 , B32B7/14 , B32B37/1207 , B32B37/18 , C09J5/06 , C09J7/35 , C09J9/02 , C09J163/00 , C09J183/04 , H01L24/29 , H01L24/83 , H01L27/1463 , H01L27/14683 , B32B2305/72 , B32B2307/202 , B32B2307/206 , B32B2309/025 , B32B2457/14 , C09J2203/326 , C09J2463/00 , C09J2483/00 , H01L2224/29191 , H01L2224/2929 , H01L2224/29339 , H01L2224/83862
摘要： A method of attaching a detector onto a substrate that has an array of electrically conducting pads is provided, together with the resulting detector assembly. The method includes pouring a non-conductive adhesive material over a substrate surface, allowing the adhesive to settle between the conducting pads to form dams around the conducting pads, applying a conductive adhesive material onto the conducting pads of the substrate, and placing a surface of the detector on the substrate surface over the conducting and non-conducting adhesives to thereby attach the surface of the detector to the surface of the substrate.
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公开(公告)号：US20240227360A9
公开(公告)日：2024-07-11
申请号：US18489143
申请日：2023-10-18
IPC分类号： B32B15/092 , B32B3/08 , B32B5/02 , B32B15/14 , B32B27/12 , B32B27/38 , B32B37/18 , B32B38/00 , B64C1/12 , B64F5/10 , H01B5/16
CPC分类号： B32B15/092 , B32B3/08 , B32B5/02 , B32B15/14 , B32B27/12 , B32B27/38 , B32B37/182 , B32B38/0004 , B64C1/12 , B64F5/10 , H01B5/16 , B32B2260/021 , B32B2260/046 , B32B2262/106 , B32B2307/202 , B32B2307/206 , B32B2605/18
摘要： A resin film configured to hold a conductive metallic track against a panel. The resin film partially covers the conductive metallic track, such that the conductive metallic track has at least one region which does not have the resin film, so as to allow an electrical connection by contact. Thus, in the context of assembly on a panel, the metallic track incorporated between the panel and the resin film is protected, thus rendering this technical solution particularly robust. Furthermore, the resin film electrically insulates the metallic track from surrounding elements, and the regions which do not have resin film allow an electrical connection by contact.
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公开(公告)号：US20240227358A9
公开(公告)日：2024-07-11
申请号：US18312135
申请日：2023-05-04
发明人： KAI-WEI LO , WEN-FENG LEE , HSIANG-YUN YANG , KUO-HSUN CHEN
CPC分类号： B32B15/08 , B32B3/02 , B32B15/20 , B32B33/00 , B32B2250/03 , B32B2250/40 , B32B2305/30 , B32B2307/206 , B32B2307/302 , B32B2307/538 , B32B2311/12
摘要： A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.
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公开(公告)号：US20240183052A1
公开(公告)日：2024-06-06
申请号：US18552244
申请日：2022-03-25
发明人： Peter HAACK , Vera PELDZINSKI-RANISCH , Grigory VAZHENIN , Hee-Bum SHIN , Jaewon LEE , Tobias BERNHARD
IPC分类号： C25D5/18 , B32B3/26 , B32B15/01 , B32B15/08 , B32B15/20 , C23C18/16 , C23C18/38 , C23C28/02 , C23F1/18 , C25D3/38 , C25D5/00 , C25D7/06 , H05K3/02
CPC分类号： C25D5/18 , B32B3/266 , B32B15/01 , B32B15/08 , B32B15/20 , C23C18/1637 , C23C18/1653 , C23C18/38 , C23C28/023 , C23F1/18 , C25D3/38 , C25D5/627 , C25D7/0614 , H05K3/022 , B32B2255/06 , B32B2255/205 , B32B2255/28 , B32B2307/206 , B32B2307/406 , B32B2307/7376 , B32B2457/08
摘要： A process for electrochemical deposition of copper, including:
providing a rolled and annealed copper foil comprising a first surface and a second surface,
etching the first surface of the rolled and annealed copper foil, thereby creating a first etched surface,
depositing copper by electroless copper deposition on the first etched surface, thereby creating a first electroless copper layer on the first etched surface,
depositing further copper by electrochemical deposition on the first electroless copper layer, thereby creating a first electrochemical copper layer, wherein in the electrochemical deposition in a first period of time a first current density is applied and in a second period of time a second current density is applied, wherein the second current density is lower than the first current density, and a layered product obtainable by the process.-
公开(公告)号：US11873398B2
公开(公告)日：2024-01-16
申请号：US16336447
申请日：2017-09-28
发明人： Tatsushi Hayashi , Takashi Nishimura , Susumu Baba
IPC分类号： C08L63/00 , B32B15/20 , B32B27/28 , B32B27/38 , H05K1/02 , H05K1/03 , B32B15/092 , B32B27/08 , B32B27/20
CPC分类号： C08L63/00 , B32B15/092 , B32B15/20 , B32B27/08 , B32B27/20 , B32B27/281 , B32B27/38 , H05K1/0298 , H05K1/0353 , B32B2307/202 , B32B2307/206 , B32B2457/08 , C08L2203/16 , C08L2203/20 , H05K2201/0154 , C08L63/00 , C08L79/08 , C08K3/36
摘要： Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.
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公开(公告)号：US11826992B2
公开(公告)日：2023-11-28
申请号：US16625930
申请日：2018-06-20
申请人： Jiva Materials Ltd
发明人： Jack Herring
IPC分类号： B32B27/12 , B32B7/06 , B32B7/12 , B32B15/14 , B32B5/12 , B32B5/26 , B32B9/02 , B32B9/04 , B32B27/30 , B32B38/10
CPC分类号： B32B27/12 , B32B5/12 , B32B5/26 , B32B7/06 , B32B7/12 , B32B9/02 , B32B9/045 , B32B15/14 , B32B27/306 , B32B38/10 , B32B2250/42 , B32B2255/02 , B32B2255/26 , B32B2260/021 , B32B2260/046 , B32B2262/065 , B32B2307/206 , B32B2307/7166 , B32B2307/748 , B32B2311/12 , B32B2317/20 , B32B2457/08
摘要： A composite structure 10 comprises one or more layers 12 of structural material and one or more layers of adhesive material 28 binding the one or more structural layers together. The one or more layers of structural material are coated with a bonding agent. The one or more layers of adhesive material are at least partially soluble or separable in water. A method of making a composite structure is also provided.
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公开(公告)号：US11820894B2
公开(公告)日：2023-11-21
申请号：US17523184
申请日：2021-11-10
发明人： Teng Xu , Zhilong Hu , Xiangnan Li , Shuwen Liu , Cheng Li
IPC分类号： C08L79/08 , C08L83/04 , C08K3/36 , B32B27/28 , C09D179/08 , H05K1/03 , B32B15/20 , B32B5/02 , B32B15/14 , B32B5/26 , C08J5/24
CPC分类号： C08L79/085 , B32B5/024 , B32B5/263 , B32B15/14 , B32B15/20 , C08J5/244 , C09D179/085 , H05K1/036 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/206 , B32B2457/08 , C08J2379/08 , C08J2483/04 , C08L2203/16 , C08L2203/20
摘要： A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including varnish transparency, varnish sedimentation property, glass transition temperature, X-axis coefficient of thermal expansion, T300 thermal resistance, resin cluster and resin filling property.
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