公开(公告)号：US20210014966A1

公开(公告)日：2021-01-14

申请号：US16916229

申请日：2020-06-30

Applicant: TDK CORPORATION

Inventor： Takaaki MORITA ,  Seiko KOMATSU ,  Seiichi TAJIMA ,  Wakiko SATO

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/02 ,  H05K3/00

Abstract: A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

公开(公告)号：US20240331920A1

公开(公告)日：2024-10-03

申请号：US18620006

申请日：2024-03-28

Applicant: TDK Corporation

Inventor： Tomofumi KURODA ,  Seiko KOMATSU ,  Hironari GOSHIMA

IPC: H01F27/26 ,  H01F27/32 ,  H02M3/00

CPC classification number: H01F27/263 ,  H01F27/324 ,  H02M3/003

Abstract: An inductor includes a first magnetic block and a second magnetic block, the first magnetic block and the second magnetic block being disposed to face each other while being separated from each other in a first direction, a coil conductor having a first conductor portion extending in a second direction, in which the first conductor portion is disposed between the first magnetic block and the second magnetic block, the first conductor portion has a first facing surface facing the first magnetic block and a second facing surface facing the second magnetic block, a first insulator is disposed between the first facing surface and the first magnetic block and between the second facing surface and the second magnetic block, and a magnetic material disposed between the first magnetic block and the second magnetic block in a region where the coil conductor and the insulator are not disposed is provided.

公开(公告)号：US20200315008A1

公开(公告)日：2020-10-01

申请号：US16813025

申请日：2020-03-09

Applicant: TDK CORPORATION

Inventor： Seiko KOMATSU ,  Takaaki MORITA ,  Seiichi TAJIMA

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46

Abstract: A multilayer board insulating sheet contains a reducing agent.

公开(公告)号：US20130256848A1

公开(公告)日：2013-10-03

申请号：US13852218

申请日：2013-03-28

Applicant: TDK CORPORATION

Inventor： Kenichi KAWABATA ,  Seiko KOMATSU

IPC: H01L23/60

CPC classification number: H01L23/60 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electromagnetic component module includes: a molding resin provided so as to cover electronic components mounted on a substrate and a surface of the substrate; and a conductive shield formed so as to further cover the molding resin. The conductive shield includes a first filler and a second filler which are different from each other and the conductive shield is connected to ground wires exposed on lateral surfaces of the substrate. The average particle diameter of the first filler is ½ or less of the thickness of the ground wires and the second filler forms a metallic bond in the temperature range of 250 degrees Celsius or lower.

Abstract translation: 电磁部件模块包括：模塑树脂，其设置成覆盖安装在基板上的电子部件和基板的表面; 以及形成为进一步覆盖模制树脂的导电屏蔽。 导电屏蔽包括彼此不同的第一填料和第二填料，并且导电屏蔽连接到暴露在基板的侧表面上的接地线。 第一填料的平均粒径为接地线的厚度的1/2或更小，第二填料在250摄氏度或更低的温度范围内形成金属键。