公开(公告)号：US11955275B2

公开(公告)日：2024-04-09

申请号：US17004334

申请日：2020-08-27

Applicant: TDK CORPORATION

Inventor： Yuya Ishima ,  Shinichi Kondo ,  Kosuke Ito ,  Shingo Hattori ,  Takashi Suzuki ,  Hidenobu Umeda

IPC: H01F41/04 ,  H01F27/28 ,  H01F41/12

CPC classification number: H01F41/041 ,  H01F27/2804 ,  H01F41/04 ,  H01F41/12 ,  H01F2027/2809

Abstract: A method for producing a multilayer coil component includes forming, on a main face of a substrate, a first coil conductor extending along the main face having conductivity, forming a second coil conductor and a third coil conductor apart from each other in a direction in which the first coil conductor extends and each extending from the first coil conductor in a first direction orthogonal to the main face, and forming a fourth coil conductor electrically connected to an end of the second coil conductor opposite to the first coil conductor and extending along the main face. The forming the first coil conductor includes forming, on the main face, a first insulator layer provided with a first penetration portion having a shape corresponding to the first coil conductor and exposing a part of the main face, and forming, by plating, the first coil conductor in the first penetration portion.

公开(公告)号：US11705276B2

公开(公告)日：2023-07-18

申请号：US17010427

申请日：2020-09-02

Applicant: TDK CORPORATION

Inventor： Yuya Ishima ,  Shinichi Kondo ,  Kosuke Ito ,  Shingo Hattori

IPC: H01F41/04 ,  H01F17/00 ,  H05K3/46 ,  H01F27/29 ,  H01F41/02 ,  H05K1/16

CPC classification number: H01F41/041 ,  H01F17/0013 ,  H01F27/292 ,  H01F41/0233 ,  H05K1/165 ,  H05K3/46

Abstract: A method for manufacturing an electronic-component includes a step of forming a laminate substrate including a plurality of laminates disposed in a direction intersecting with a lamination direction via a division portion by laminating a plurality of insulator layers, and a step of singulating the plurality of laminates by removing the division portion. The step of forming the laminate substrate includes a step of forming an insulator resist layer containing an insulating material on a base material, the insulating material being a constituent material of each of the insulator layers and a step of forming the insulator layer by curing the insulator resist layer by exposure, except for at least an insulator resist portion corresponding to the division portion. The division portion including the insulator resist portion is removed by development in the step of singulating.

公开(公告)号：US20240331929A1

公开(公告)日：2024-10-03

申请号：US18404362

申请日：2024-01-04

Applicant: TDK CORPORATION

Inventor： Keito YASUDA ,  Yusuke Nagai ,  Makoto Yoshino ,  Masaki Takahashi ,  Shinichi Sato ,  Yuya Ishima ,  Shingo Hattori ,  Youhei Iida ,  Mitsuharu Koike ,  Takato Sasaki

IPC: H01F27/29 ,  H01F27/28

CPC classification number: H01F27/292 ,  H01F27/2804 ,  H01F2027/2809

Abstract: A coil component 1 includes an element body having a mounting surface, a coil disposed in the element body, terminal electrodes disposed on the mounting surface of the element body, and a first connection conductor and a second connection conductor connecting the coil and the terminal electrodes, respectively, in which the first connection conductor and the second connection conductor have first portions connected to the terminal electrodes, second portions connected to the coil, and third portions connecting the first portions and the second portions, respectively, and an area of a first pore per unit area in the first portion is larger than an area of a third pore per unit area in the third portion.

公开(公告)号：US12249453B2

公开(公告)日：2025-03-11

申请号：US17523202

申请日：2021-11-10

Applicant: TDK CORPORATION

Inventor： Yusuke Nagai ,  Kazuhiro Ebina ,  Kouichi Kakuda ,  Kunihiko Kawasaki ,  Shinichi Kondo ,  Yuya Ishima ,  Masaki Takahashi ,  Takahiro Sato ,  Keito Yasuda ,  Shingo Hattori

IPC: H01F5/00 ,  H01F17/00 ,  H01F17/04 ,  H01F27/29

Abstract: In a multilayer coil component, a coil is configured by electrically connecting coil conductors respectively provided in magnetic body layers constituting an element body and metal magnetic particles have a normal particle having an ellipsoidal shape and flat particles having an ellipsoidal shape flatter in a thickness direction than the normal particle. A plurality of the normal particles and at least one of the flat particles disposed such that a surface (reference surface) including a major axis direction orthogonal to the thickness direction and a minor axis direction is along the forming surface of the coil conductor in the magnetic body layer are arranged in the lamination direction of the magnetic body layers between the coil conductors.

公开(公告)号：US11915852B2

公开(公告)日：2024-02-27

申请号：US16922533

申请日：2020-07-07

Applicant: TDK CORPORATION

Inventor： Yuya Ishima ,  Shinichi Kondo ,  Kosuke Ito ,  Shingo Hattori ,  Kazuya Tobita ,  Noriaki Hamachi ,  Atsushi Moriya

IPC: H01F5/00 ,  H01F27/28 ,  H01F41/04 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F27/29 ,  H01F41/043 ,  H01F2027/2809

Abstract: An electronic component according to an aspect of the present disclosure includes an element body and a terminal electrode. The element body includes an outer surface provided with a depression. The terminal electrode is disposed on the element body. The terminal electrode includes a first electrode portion and a second electrode portion. The first electrode portion is disposed in the depression. The second electrode portion protrudes from the depression. The second electrode portion is thicker than the first electrode portion.