CERAMIC ELECTRONIC DEVICE
    1.
    发明申请

    公开(公告)号:US20210027945A1

    公开(公告)日:2021-01-28

    申请号:US16932298

    申请日:2020-07-17

    Abstract: The present invention relates to a ceramic electronic device including a ceramic body having ceramic layers and internal electrode layers stacked in alternating manner and a terminal electrode formed at an end face of the ceramic body. The terminal electrode includes a base electrode including a metal component and a glass component, an intermediate electrode layer including Ni and formed at an outer face of the base electrode layer, and an upper electrode layer including Pd or Au and formed at an outer face of the intermediate electrode layer. Also, a surface roughness Ra1 of the base electrode layer in the terminal electrode is 5.0 μm or less; or the surface roughness Ra1 of the base electrode layer, a surface roughness Ra2 of the intermediate electrode layer, and a surface roughness Ra3 of the upper electrode layer satisfy a relationship of Ra1>Ra3≥Ra2.

    ELECTRONIC COMPONENT STRUCTURE
    2.
    发明公开

    公开(公告)号:US20240321520A1

    公开(公告)日:2024-09-26

    申请号:US18603515

    申请日:2024-03-13

    CPC classification number: H01G4/2325 H01G4/30

    Abstract: An electronic component structure includes: a first electronic component; a second electronic component; a low melting point layer located between the first electronic component and the second electronic component and containing a first metal material having a melting point of 300° C. or lower; and a high melting point layer located between the first electronic component and the second electronic component and containing a second metal material having a melting point of 400° C. or higher. In the electronic component structure, the first electronic component and the second electronic component are connected to each other by a multilayer connection portion formed by overlapping the low melting point layer and the high melting point layer.

    ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT STRUCTURE

    公开(公告)号:US20240321518A1

    公开(公告)日:2024-09-26

    申请号:US18609537

    申请日:2024-03-19

    CPC classification number: H01G4/232 H01G2/065 H01G4/008 H01G4/012 H01G4/30

    Abstract: An electronic component includes an element body portion and a terminal electrode portion formed. The terminal electrode portion includes a base electrode layer that is in direct contact with the end surface and a surface electrode layer that covers the base electrode layer and constitutes an outermost surface of the terminal electrode portion. A relation between a thickness T2 of the surface electrode layer and a thickness T4 of the surface electrode layer satisfies 1.3≤T4/T2≤15.0, while the T2 is along a second reference line parallel to the lower surface and passes through a height of three quarters of the entire element body portion from the lower surface, and the T4 is along a fourth reference line parallel to the lower surface and passes through a height of one quarter of the entire element body portion from the lower surface.

    DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC COMPONENT
    5.
    发明申请
    DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC COMPONENT 有权
    电介质陶瓷组合物和电子元件

    公开(公告)号:US20150274597A1

    公开(公告)日:2015-10-01

    申请号:US14663160

    申请日:2015-03-19

    Abstract: A dielectric ceramic composition includes at least dielectric particles having a core-shell structure and segregation particles, a concentration of a rare earth compound in the segregation particle is twice or more than an average concentration of the rare earth compound in a shell part of the dielectric particle having the core-shell structure, an area occupied by the segregation particles is 0.1 to 1.1%, when a maximum particle size of the segregation particle is defined as rbmax, a minimum particle size of the segregation particle is defined as rbmin, and an average particle size of the dielectric particle having the core-shell structure is defined as ra, a relation of rbmax/ra≦2.00 and rbmin/ra≧0.25 is satisfied, and the segregation particles substantially do not include Mg.

    Abstract translation: 电介质陶瓷组合物至少包括具有核 - 壳结构和偏析粒子的电介质粒子,偏析粒子中稀土化合物的浓度是电介质的外壳部分中稀土化合物的平均浓度的两倍或更多 具有核 - 壳结构的粒子,由偏析粒子占据的面积为0.1〜1.1%,将分离粒子的最大粒径定义为rbmax时,将分离粒子的最小粒径定义为rbmin,将 具有核 - 壳结构的电介质粒子的平均粒径被定义为ra,满足rbmax / ra≦̸ 2.00和rbmin /ra≥0.25的关系,并且偏析粒子基本上不包括Mg。

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