公开(公告)号：US20140118882A1

公开(公告)日：2014-05-01

申请号：US14024398

申请日：2013-09-11

Applicant: TDK Corporation

Inventor： Sunao MASUDA ,  Katsumi KOBAYASHI ,  Takashi KOMATSU ,  Akitoshi YOSHII ,  Kazuyuki HASEBE ,  Kayou KUSANO ,  Norihisa ANDO

IPC: H01G4/228 ,  H01G4/12

CPC classification number: H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30

Abstract: A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.

Abstract translation: 一种具有金属端子的陶瓷电子部件，包括在两端形成有端子电极的芯片部件，以及一对金属端子，包括具有平板部分的平板部分，所述平板部分面对面设置成使其面对所述芯片部件的端面， 通过接合部分连接到所述端子电极，以及安装部分，其连接到所述平板部分的一个端部并且大致垂直于所述平板部分延伸，其中所述安装部分具有形成约270°的角度的安装部分底面 形成相对于所述平板部分的角度以及相对于所述平板部分形成大约90度的角度的安装部分上表面，并且形成具有比所述安装部分底面更低的润湿性的阻焊区域。