公开(公告)号：US20240364291A1

公开(公告)日：2024-10-31

申请号：US18641783

申请日：2024-04-22

Applicant: TDK Corporation

Inventor： Toshiyuki ABE ,  Ichiro YAGINUMA ,  Kazutoshi TSUYUTANI ,  Takuya SHIMAMURA

IPC: H03H7/01 ,  H01R12/58 ,  H01R12/75 ,  H01R13/66 ,  H01R13/7197 ,  H05K1/11 ,  H05K1/16 ,  H05K1/18

CPC classification number: H03H7/01 ,  H01R13/7197 ,  H05K1/117 ,  H05K1/165 ,  H05K1/185 ,  H01R12/58 ,  H01R12/75 ,  H01R13/6666 ,  H05K2201/09181 ,  H05K2201/10174 ,  H05K2201/10189

Abstract: Disclosed herein is a circuit board that includes: a plurality of insulating layers, a common mode filter and an electronic component embedded in the insulating layers, and first to fifth outer electrodes. The first coil pattern of the common mode filter is connected between the first and second outer electrodes. The second coil pattern of the common mode filter is connected between the third and fourth outer electrodes. The electronic component is connected between the first and second outer electrodes and the fifth outer electrode. The electronic component is arranged so as not to overlap the first coil pattern and the second coil pattern.