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公开(公告)号：US20240334609A1
公开(公告)日：2024-10-03
申请号：US18609434
申请日：2024-03-19
Applicant: TDK Corporation
Inventor： Toshiyuki ABE , Kazutoshi TSUYUTANI , Naoyuki ISHIKAWA
CPC classification number: H05K1/182 , H05K1/0237 , H05K1/111 , H05K1/115 , H05K2201/10439
Abstract: Disclosed herein is an apparatus that includes a multilayer substrate including a plurality of conductive layers and a plurality of insulating layers alternately stacked, and an electronic component having a first signal pad. The plurality of conductive layers include a first internal conductive layer having a first signal pattern, and a second internal conductive layer having a second signal pattern. The plurality of insulating layers include a first insulating layer positioned between the first and second internal conductive layers. The electronic component is embedded in the first insulating layer such that the first signal pad is connected to the first signal pattern. The first and second signal patterns are connected to each other by a first via conductor penetrating through the first insulating layer. The distance between the electronic component and the first via conductor is greater than a diameter of the first via conductor.
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公开(公告)号：US20240412917A1
公开(公告)日：2024-12-12
申请号：US18696745
申请日：2022-06-27
Applicant: TDK Corporation
Inventor： Takeshi YOKOYAMA , Toshiyuki ABE , Yuki HASHIMOTO , Takeshi OKUMURA , Tomonaga NISHIKAWA
Abstract: To prevent the occurrence of a short-circuit failure through a magnetic body layer. A coil component includes interlayer insulating films and conductor layers which are alternately stacked on a magnetic body layer. The conductor layers respectively have coil patterns, terminal patterns which are provided at positions overlapping a terminal electrode, and terminal patterns which are provided at positions overlapping a terminal electrode. The terminal patterns are connected to the terminal electrode, and the terminal patterns are connected to the terminal electrode. The terminal pattern is insulated from the terminal electrode. This can prevent a short circuit failure between a coil pattern or terminal pattern and the terminal pattern through the magnetic body layer.
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公开(公告)号：US20220238474A1
公开(公告)日：2022-07-28
申请号：US17618666
申请日：2020-06-05
Applicant: TDK Corporation
Inventor： Toshiyuki ABE , Yoshihiro SUZUKI , Hironori CHIBA , Tetsuya YAZAKI , Hiroshige OHKAWA
IPC: H01L23/00 , H01L23/367 , H01L25/16 , H01S5/0233 , H01S5/024
Abstract: An electronic component embedded substrate includes an electronic component and a heat transfer block which are embedded in insulating layers, a first wiring patterns facing a first surface of the heat transfer block, a second wiring pattern facing a second surface of the heat transfer block, a first via conductor connecting the first wiring pattern and the first surface of the heat transfer block, and a second via conductor connecting the second wiring pattern and the second surface of the heat transfer block. The first and second surfaces and are insulated from each other. Thus, even when an electronic component of a type having large heat generation and being prohibited from connecting to a ground pattern is mounted, the second wiring pattern functioning as a heat dissipation pattern can be connected to a ground pattern on a motherboard.
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公开(公告)号：US20240395452A1
公开(公告)日：2024-11-28
申请号：US18695782
申请日：2022-06-27
Applicant: TDK Corporation
Inventor： Yuki HASHIMOTO , Toshiyuki ABE , Takeshi OKUMURA , Tomonaga NISHIKAWA , Masanori SUZUKI
Abstract: To provide a stacked coupling coil component capable of achieving a desired coupling coefficient while suppressing the height of the component. A stacked coupling coil component 1 has conductor layers L1, L3, and L5 respectively including spiral coils 11 to 13, conductor layers L2, L4, and L6 respectively including spiral coils 21 to 23, and a conductor layer L7 including spiral coils 31 and 41 which are disposed at mutually different planar positions. The spiral coils 11 to 13 and 21 to 23 overlap one another. The spiral coils 11 to 13 and 31 are connected in series between terminal electrodes E1 and E2, the spiral coils 21 to 23 and 41 are connected in series between terminal electrodes E4 and E3. This allows adjustment of a coupling coefficient, making it possible to achieve a desired coupling coefficient while suppressing the height of the component.
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公开(公告)号：US20240087787A1
公开(公告)日：2024-03-14
申请号：US18463649
申请日：2023-09-08
Applicant: TDK Corporation
Inventor： Yuki HASHIMOTO , Toshiyuki ABE , Takeshi OKUMURA , Tomonaga NISHIKAWA , Naoaki FUJII , Kazuhiro YOSHIKAWA
CPC classification number: H01F17/0013 , H01F17/04 , H01F27/022 , H01F27/292
Abstract: Disclosed herein is a coil component that includes a coil part embedded in a magnetic element body. The coil part has a structure in which plural interlayer insulating films and plural conductor layers having a coil pattern are alternately stacked. At least one of the conductor layers has a clearance area having no coil pattern and extending radially outward from a center axis of the coil part. The magnetic element body includes a first magnetic resin layer provided in an inner diameter area of the coil part, a second magnetic resin layer provided in a radially outside area of the coil part, and a fifth magnetic resin layer filled in the clearance area and contacting the first and second magnetic resin layers.
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Patent Agency Ranking
公开(公告)号：US20230137323A1
公开(公告)日：2023-05-04
申请号：US17972031
申请日：2022-10-24
Applicant: TDK Corporation
Inventor： Mitsuru MIURA , Toshiyuki ABE , Tomonaga NISHIKAWA , Masaki ENDO , Masaki YONEYAMA
Abstract: Disclosed herein is a coil component that includes a first conductor layer, one or more third conductor layers, and a second conductor layer stacked one another in this order. One end of the coil pattern in the first conductor layer is connected to first terminal patterns in the second and third conductor layers. The first terminal pattern in the second conductor layer is connected to a first terminal electrode. One end of the coil pattern in the second conductor layer is connected to a second terminal electrode. The width in a radial direction of the first terminal pattern positioned in the third conductor layer is larger than the width in the radial direction of the second terminal pattern positioned in the third conductor layer.
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公开(公告)号：US20240364291A1
公开(公告)日：2024-10-31
申请号：US18641783
申请日：2024-04-22
Applicant: TDK Corporation
Inventor： Toshiyuki ABE , Ichiro YAGINUMA , Kazutoshi TSUYUTANI , Takuya SHIMAMURA
CPC classification number: H03H7/01 , H01R13/7197 , H05K1/117 , H05K1/165 , H05K1/185 , H01R12/58 , H01R12/75 , H01R13/6666 , H05K2201/09181 , H05K2201/10174 , H05K2201/10189
Abstract: Disclosed herein is a circuit board that includes: a plurality of insulating layers, a common mode filter and an electronic component embedded in the insulating layers, and first to fifth outer electrodes. The first coil pattern of the common mode filter is connected between the first and second outer electrodes. The second coil pattern of the common mode filter is connected between the third and fourth outer electrodes. The electronic component is connected between the first and second outer electrodes and the fifth outer electrode. The electronic component is arranged so as not to overlap the first coil pattern and the second coil pattern.
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公开(公告)号：US20230326667A1
公开(公告)日：2023-10-12
申请号：US18183516
申请日：2023-03-14
Applicant: TDK Corporation
Inventor： Yuki HASHIMOTO , Toshiyuki ABE , Takeshi OKUMURA , Masanori SUZUKI
CPC classification number: H01F27/292 , H01F27/24 , H01F27/323
Abstract: Disclosed herein is a coil component that includes: a coil part including a coil conductor embedded in the magnetic element body and a bump electrode embedded in the magnetic element body through a second insulating resin layer and connected to an end portion of a coil conductor. A side surface of the bump electrode at a mounting surface is covered with the second insulating resin layer. The second insulating resin layer covering the side surface of the bump electrode has a first area having a first width in a planar direction parallel with the mounting surface and a second area having a second width in the planar direction larger than the first width.
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公开(公告)号：US20230317358A1
公开(公告)日：2023-10-05
申请号：US18180510
申请日：2023-03-08
Applicant: TDK Corporation
Inventor： Mitsuru MIURA , Toshiyuki ABE , Tomonaga NISHIKAWA , Masaki ENDO , Masaki YONEYAMA
CPC classification number: H01F27/292 , H01F27/32 , H01F27/02
Abstract: Disclosed herein is a coil component that includes a conductor layer including a coil pattern and a terminal pattern provided independently of the coil pattern and exposed from the magnetic element body. The terminal pattern includes a linear part having a substantially constant pattern width in a direction perpendicular to the side surface of the magnetic element body, a widened part positioned at one end side in a second direction. The outermost turn of the coil pattern includes a first section provided along the linear part, a second section provided along the widened part, and a fourth section provided along the magnetic element body and positioned on a side opposite to the first section with respect to the second section. The pattern width of the coil pattern is larger in the second sections than in the first and fourth sections.
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公开(公告)号：US20140333274A1
公开(公告)日：2014-11-13
申请号：US14273467
申请日：2014-05-08
Applicant: TDK Corporation
Inventor： Toshiyuki ABE , Hironori CHIBA , Mikihiro KUMON , Hiroshi TUJI
IPC: H02M3/158
CPC classification number: H02M3/158 , H01L2224/16225 , H01L2924/15311 , H02H7/12 , H02M1/32
Abstract: A complex power management device includes DC/DC converters and a common reference line connected in common to the DC/DC converters. Each of the DC/DC converters includes a first switch element and inductor connected in series between first and second nodes, a second switch element, one end of which is connected to a third node that is a connection point of the first switch element and the inductor and the other end of which is connected to the corresponding ground terminal, and an output voltage adjustment circuit, which exclusively controls an ON/OFF state of the first and second switch elements based on a voltage of a fourth node that is the other end of the second switch element. The common reference line is connected to a fifth node that is provided on a wire connecting the second switch element of each of the DC/DC converters to the ground terminal.
Abstract translation: 一个复杂的电源管理器件包括DC / DC转换器和一个与DC / DC转换器共同连接的公共参考线。 每个DC / DC转换器包括在第一和第二节点之间串联连接的第一开关元件和电感器，第二开关元件，其一端连接到作为第一开关元件的连接点的第三节点和 电感器，其另一端连接到对应的接地端子，以及输出电压调节电路，其基于作为另一端的第四节点的电压专门控制第一和第二开关元件的导通/截止状态 的第二开关元件。 公共参考线连接到第五节点，该第五节点设置在将每个DC / DC转换器的第二开关元件连接到接地端子的导线上。
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