公开(公告)号：US20170287513A1

公开(公告)日：2017-10-05

申请号：US15084956

申请日：2016-03-30

Applicant: TDK Corporation

Inventor： Koji SHIMAZAWA ,  Shuji OKAME ,  Yoshihiro TSUCHIYA ,  Takafumi KOBAYASHI

IPC: G11B5/39 ,  G11B5/48

CPC classification number: G11B5/314 ,  G11B5/012 ,  G11B5/127 ,  G11B5/187 ,  G11B5/313 ,  G11B5/3133 ,  G11B5/6088 ,  G11B2005/0021

Abstract: A thermal assisted magnetic recording head that performs magnetic recording while locally heating a magnetic recording medium includes: a plasmon generator that generates a surface plasmon and that generates near-field light from the surface plasmon on a front end surface positioned on an air bearing surface opposing the magnetic recording medium; a dielectric body layer positioned around the plasmon generator; and an adhesion layer positioned between the plasmon generator and the dielectric body layer. The adhesion layer is made from at least one of IrOx, RuOx, NiOx and CoOx.

公开(公告)号：US20150040390A1

公开(公告)日：2015-02-12

申请号：US14492244

申请日：2014-09-22

Applicant: TDK CORPORATION ,  ROHM CO., LTD. ,  SAE MAGNETICS (H.K.) LTD.

Inventor： Koji SHIMAZAWA ,  Osamu SHINDO ,  Yoshihiro TSUCHIYA ,  Yasuhiro ITO ,  Kenji SAKAI

IPC: H05K3/34

CPC classification number: H05K3/3421 ,  B23K1/0016 ,  H01S5/02236 ,  H01S5/02272 ,  Y10T29/49144

Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

Abstract translation: 本发明的激光二极管单元的制造方法包括以下步骤：将激光二极管放置在形成在基座的安装表面上的焊料构件的顶部上，向激光二极管施加按压负载并将激光二极管按压在焊料构件上 接下来，在施加加压负荷的同时，通过在高于焊料构件的熔点的温度下加热焊料部件来熔化焊料部件，之后，通过冷却固化焊料部件将激光二极管接合到副安装台， 然后，除去加压负荷，通过在除去加压负荷后，在低于焊料构件的熔点的温度下加热焊料，软化固化的焊料，然后冷却并重新固化焊料。

公开(公告)号：US20170278530A1

公开(公告)日：2017-09-28

申请号：US15080964

申请日：2016-03-25

Applicant: TDK Corporation

Inventor： Koji SHIMAZAWA ,  Tsutomu CHOU ,  Yoshihiro TSUCHIYA ,  Kosuke TANAKA

IPC: G11B5/48

CPC classification number: G11B5/4866 ,  G11B5/012 ,  G11B5/127 ,  G11B5/3116 ,  G11B5/314 ,  G11B5/3163 ,  G11B5/6088 ,  G11B2005/0021

Abstract: A plasmon generator generates surface plasmon and generates near-field light from the surface plasmon at a distal end surface situated on an air bearing surface facing a magnetic recording medium. The plasmon generator has a first portion including the distal end surface, a second portion situated away from the air bearing surface, and a separating layer situated between the first portion and the second portion and separating the first portion from the second portion.