公开(公告)号：US20230354710A1

公开(公告)日：2023-11-02

申请号：US17753244

申请日：2021-06-02

Applicant: TDK Electronics AG

Inventor： Marko Vrabelj ,  Sebastian Redolfi

IPC: H10N30/00 ,  H10N30/853 ,  H10N30/078 ,  H10N30/079 ,  G02B26/08 ,  C01G25/00

CPC classification number: H10N30/10516 ,  H10N30/8554 ,  H10N30/078 ,  H10N30/079 ,  G02B26/0858 ,  C01G25/006 ,  B06B1/0603

Abstract: Piezoelectric assembly, which comprises a substrate of Ni, Cu, or steel, a first oriented layer assembled on the substrate and a piezoelectric layer on the oriented layer. The piezoelectric layer has a degree of (100) orientation with respect to the local surface normal of 90% or more.

公开(公告)号：US20220287187A1

公开(公告)日：2022-09-08

申请号：US17637725

申请日：2020-10-12

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Thomas Bernert ,  Stefan Endler ,  Michael Krenn ,  Stephan Bigl ,  Markus Puff ,  Sebastian Redolfi

IPC: H05K3/30 ,  H05K1/18 ,  H01G2/06 ,  H05K3/34 ,  H01C7/02

Abstract: In an embodiment a component includes at least one carrier layer, the carrier layer having a top side and a bottom side and at least one functional layer arranged on the top side of the carrier layer, the functional layer including a material having a specific electrical characteristic, wherein the component is configured for direct integration into an electrical system as a discrete component.

公开(公告)号：US12033774B2

公开(公告)日：2024-07-09

申请号：US17617760

申请日：2020-07-03

Applicant: TDK Electronics AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Christl Lisa Mead ,  Thomas Bernert ,  Sebastian Redolfi ,  Marko Vrabelj

IPC: H01C7/04 ,  H01C1/14 ,  H01C7/00 ,  H01C17/075 ,  H05K1/18

CPC classification number: H01C7/042 ,  H01C1/14 ,  H01C7/006 ,  H01C17/075 ,  H05K1/182 ,  H05K2201/10196

Abstract: An NTC thin film thermistor that includes at least a first thin film electrode, at least an NTC thin film, and at least a second thin film electrode. A further aspect relates to a method for producing an NTC thin film thermistor.

公开(公告)号：US12177986B2

公开(公告)日：2024-12-24

申请号：US17637725

申请日：2020-10-12

Applicant: TDK Electronics AG

Inventor： Jan Ihle ,  Thomas Bernert ,  Stefan Endler ,  Michael Krenn ,  Stephan Bigl ,  Markus Puff ,  Sebastian Redolfi

IPC: H05K3/30 ,  H01C7/02 ,  H01G2/06 ,  H05K1/18 ,  H05K3/34

Abstract: In an embodiment a component includes at least one carrier layer, the carrier layer having a top side and a bottom side and at least one functional layer arranged on the top side of the carrier layer, the functional layer including a material having a specific electrical characteristic, wherein the component is configured for direct integration into an electrical system as a discrete component.

公开(公告)号：US20220238260A1

公开(公告)日：2022-07-28

申请号：US17617760

申请日：2020-07-03

Applicant: TDK Electronics AG

Inventor： Thomas Stendel ,  Jan Ihle ,  Christl Lisa Mead ,  Thomas Bernert ,  Sebastian Redolfi ,  Marko Vrabelj

IPC: H01C7/04 ,  H01C7/00 ,  H05K1/18 ,  H01C1/14 ,  H01C17/075

Abstract: An NTC thin film thermistor that includes at least a first thin film electrode, at least an NTC thin film, and at least a second thin film electrode. A further aspect relates to a method for producing an NTC thin film thermistor.