REACTIVE 2-COMPONENT ADHESIVE SYSTEM IN FILM FORM HAVING IMPROVED HEAT-AND-HUMIDITY RESISTANCE

    公开(公告)号:US20200062998A1

    公开(公告)日:2020-02-27

    申请号:US16466148

    申请日:2017-11-22

    申请人: TESA SE

    IPC分类号: C09J4/06 C09J7/38

    摘要: The present invention relates to a reactive adhesive film comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer or reactive resin, and (c) a reagent selected from an initiator, in particular a radical initiator, or an activator, featuring enhanced heat-and-humidity resistance, and to a reactive 2-component adhesive system in film form for bonding diverse materials, such as, for example, metal, wood, glass and/or plastic material.