-
公开(公告)号:US20220375891A1
公开(公告)日:2022-11-24
申请号:US17867554
申请日:2022-07-18
申请人: TESSERA LLC
发明人: Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号: H01L23/00 , H01L23/13 , H01L23/31 , H01L23/495 , H01L23/498 , H01L25/065 , H01L25/10 , H01L25/16 , H01L25/04 , H01L27/146
摘要: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
-
公开(公告)号:US11424211B2
公开(公告)日:2022-08-23
申请号:US17086785
申请日:2020-11-02
申请人: TESSERA LLC
发明人: Hiroaki Sato , Teck-Gyu Kang , Belgacem Haba , Philip R. Osborn , Wei-Shun Wang , Ellis Chau , Ilyas Mohammed , Norihito Masuda , Kazuo Sakuma , Kiyoaki Hashimoto , Kurosawa Inetaro , Tomoyuki Kikuchi
IPC分类号: H01L23/00 , H01L23/13 , H01L23/31 , H01L23/495 , H01L23/498 , H01L25/065 , H01L25/10 , H01L25/16 , H01L25/04 , H01L27/146 , H01L21/56 , H01L23/538
摘要: Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
-