Abstract:
A light-emitting semiconductor diode is made from an N-type crystal of GaAsP or GaP by the selective diffusion of zinc therein to form a PN junction. A special diffusion mask system is employed, to obtain a combination of direct diffusion into an unmasked region, and lateral diffusion beneath a selected portion of the mask. The major, active portion of the junction is formed by lateral diffusion, whereas that portion of the P-region formed by direct diffusion serves primarily as a preferred location for contact metallization.