公开(公告)号：US3617375A

公开(公告)日：1971-11-02

申请号：US3617375D

申请日：1969-08-11

Applicant: TEXAS INSTRUMENTS INC

Inventor： MAREK DANIEL A ,  KREISELMAIER KURT W ,  TASSEL JAMES H VAN

IPC: H01L21/00 ,  H01L21/316 ,  H01L23/522 ,  B41M3/08

CPC classification number: H01L21/00 ,  H01L21/02164 ,  H01L21/02266 ,  H01L21/31612 ,  H01L23/522 ,  H01L2924/0002 ,  Y10T29/43 ,  H01L2924/00

Abstract: Disclosed is a method of forming multilevel electrically conductive interconnections for microminiature devices by electron beam evaporation of a layer of quartz over the first level of interconnections. A second level of interconnections are formed on the quartz layer and make ohmic contact to the first level of interconnections through openings in the quartz layer.