公开(公告)号：US20210020528A1

公开(公告)日：2021-01-21

申请号：US16932128

申请日：2020-07-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Bernhard Peter LANGE

IPC: H01L23/10 ,  H01L23/053 ,  H01L23/16 ,  H01L23/00 ,  H01L21/56 ,  G01N27/28 ,  G01N27/416

Abstract: In some examples, a device comprises a substrate including a notch formed in a surface of the substrate and a semiconductor die positioned in the notch and including an electrochemical sensor on an active surface of the semiconductor die. The device also comprises a chemically inert member abutting the surface of the substrate and including an orifice in vertical alignment with the electrochemical sensor as a result of the semiconductor die being positioned in the notch. The device also comprises a compressed o-ring seal positioned between the chemically inert member and the active surface of the semiconductor die, the compressed o-ring seal circumscribing the electrochemical sensor.

公开(公告)号：US20200185282A1

公开(公告)日：2020-06-11

申请号：US16572303

申请日：2019-09-16

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Heinrich WACHINGER ,  Bernhard Peter LANGE

IPC: H01L21/66 ,  H01L23/00 ,  H01L21/67 ,  G01N33/18 ,  G01N27/07

Abstract: In examples, a method of manufacturing a fluid sensing package comprises coupling a semiconductor die to a first set of conductive terminals; positioning the semiconductor die within a socket, a fluid probe extending through a probe orifice in a lid of the socket; positioning a ring of the fluid probe on a fluid sensing portion of the semiconductor die by closing the lid of the socket; and using the fluid probe to apply fluid to an area of the fluid sensing portion circumscribed by the ring.