公开(公告)号：US20200185282A1

公开(公告)日：2020-06-11

申请号：US16572303

申请日：2019-09-16

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian MEIER ,  Heinrich WACHINGER ,  Bernhard Peter LANGE

IPC: H01L21/66 ,  H01L23/00 ,  H01L21/67 ,  G01N33/18 ,  G01N27/07

Abstract: In examples, a method of manufacturing a fluid sensing package comprises coupling a semiconductor die to a first set of conductive terminals; positioning the semiconductor die within a socket, a fluid probe extending through a probe orifice in a lid of the socket; positioning a ring of the fluid probe on a fluid sensing portion of the semiconductor die by closing the lid of the socket; and using the fluid probe to apply fluid to an area of the fluid sensing portion circumscribed by the ring.