公开(公告)号：US11751353B2

公开(公告)日：2023-09-05

申请号：US17318276

申请日：2021-05-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Woochan Kim ,  Vivek Kishorechand Arora ,  David Ryan Huitink ,  Hayden Seth Carlton ,  Fang Luo ,  Asif Imran Emon

IPC: H05K7/14 ,  H05K7/20 ,  H02K7/14 ,  H02M7/00 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K7/1432 ,  H02K7/14 ,  H02M7/003 ,  H05K1/112 ,  H05K1/144 ,  H05K7/209

Abstract: A power conversion module and method of forming the same includes a motherboard having a first surface and a second surface that opposes the first surface. The motherboard includes a first trace that electrically couples a decoupling capacitor mounted on the motherboard to a first pad on the first surface of the motherboard and an output node of a power conversion module. The motherboard includes a via extending through the motherboard that electrically couples a second pad on the first surface of the motherboard and a third pad on the second surface of the motherboard to the output node and a second trace that electrically couples a fourth pad on the second surface of the motherboard and the decoupling capacitor. The power module includes a first daughterboard mounted on the first surface of the motherboard and a second daughterboard mounted on the second surface of the motherboard.

公开(公告)号：US20220029519A1

公开(公告)日：2022-01-27

申请号：US17318276

申请日：2021-05-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Woochan Kim ,  Vivek Kishorechand Arora ,  David Ryan Huitink ,  Hayden Seth Carlton ,  Fang Luo ,  Asif Imran Emon

IPC: H02M1/00 ,  H05K7/20

Abstract: A power conversion module includes a motherboard having a first surface and a second surface that opposes the first surface. The motherboard includes a first trace that electrically couples a decoupling capacitor mounted on the motherboard to a first pad on the first surface of the motherboard and an output node of a power conversion module. The motherboard includes a via extending through the motherboard that electrically couples a second pad on the first surface of the motherboard and a third pad on the second surface of the motherboard to the output node and a second trace that electrically couples a fourth pad on the second surface of the motherboard and the decoupling capacitor. The power module includes a first daughterboard mounted on the first surface of the motherboard and a second daughterboard mounted on the second surface of the motherboard.

公开(公告)号：US20230413467A1

公开(公告)日：2023-12-21

申请号：US18459419

申请日：2023-09-01

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Woochan Kim ,  Vivek Kishorechand Arora ,  David Ryan Huitink ,  Hayden Seth Carlton ,  Fang Luo ,  Asif Imran Emon

IPC: H05K7/14 ,  H05K7/20 ,  H02K7/14 ,  H02M7/00 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K7/1432 ,  H05K7/209 ,  H02K7/14 ,  H02M7/003 ,  H05K1/144 ,  H05K1/112

Abstract: A power conversion module and method of forming the same includes a motherboard having a first surface and a second surface that opposes the first surface. The motherboard includes a first trace that electrically couples a decoupling capacitor mounted on the motherboard to a first pad on the first surface of the motherboard and an output node of a power conversion module. The motherboard includes a via extending through the motherboard that electrically couples a second pad on the first surface of the motherboard and a third pad on the second surface of the motherboard to the output node and a second trace that electrically couples a fourth pad on the second surface of the motherboard and the decoupling capacitor. The power module includes a first daughterboard mounted on the first surface of the motherboard and a second daughterboard mounted on the second surface of the motherboard.