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    SEMICONDUCTOR PACKAGE WITH ISOLATED HEAT SPREADER
    2.
    发明申请
    SEMICONDUCTOR PACKAGE WITH ISOLATED HEAT SPREADER 有权

    公开(公告)号：US20220238424A1

    公开(公告)日：2022-07-28

    申请号：US17719246

    申请日：2022-04-12

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Anindya Poddar ,  Woochan Kim ,  Vivek Kishorechand Arora

    IPC: H01L23/498 ,  H01L23/367 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00 ,  H01L25/16

    Abstract: A semiconductor package includes a metallic pad and leads, a semiconductor die attached to the metallic pad, the semiconductor die including an active side with bond pads opposite the metallic pad, a wire bond extending from a respective bond pad of the semiconductor die to a respective lead of the leads, a heat spreader over the active side of the semiconductor die with a gap separating the active side of the semiconductor die from the heat spreader, an electrically insulating material within the gap and in contact with the active side of the semiconductor die and the heat spreader; and mold compound covering the semiconductor die and the wire bond, and partially covering the metallic pad and the heat spreader, with the metallic pad exposed on a first outer surface of the semiconductor package and with the heat spreader exposed on a second outer surface of the semiconductor package.

    Embedded die packaging with integrated ceramic substrate
    3.
    发明授权
    Embedded die packaging with integrated ceramic substrate 有权

    公开(公告)号：US11183460B2

    公开(公告)日：2021-11-23

    申请号：US16132906

    申请日：2018-09-17

    Applicant: Texas Instruments Incorporated

    Inventor： Woochan Kim ,  Mutsumi Masumoto ,  Kengo Aoya ,  Vivek Kishorechand Arora ,  Anindya Poddar

    IPC: H01L23/538 ,  H01L23/373 ,  H01L21/56 ,  H01L23/498

    Abstract: Packaged electronic devices and integrated circuits include a ceramic material or other thermally conductive, electrically insulating substrate with a patterned electrically conductive feature on a first side, and an electrically conductive layer on a second side. The IC further includes a semiconductor die mounted to the substrate, the semiconductor die including an electrically conductive contact structure, and an electronic component, with an electrically insulating lamination structure enclosing the semiconductor die, the frame and the thermal transfer structure. A redistribution layer with a conductive structure is electrically connected to the electrically conductive contact structure.

    HEAT SLUG ATTACHED TO A DIE PAD FOR SEMICONDUCTOR PACKAGE
    5.
    发明申请
    HEAT SLUG ATTACHED TO A DIE PAD FOR SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20250022782A1

    公开(公告)日：2025-01-16

    申请号：US18901148

    申请日：2024-09-30

    Applicant: Texas Instruments Incorporated

    Inventor： Woochan Kim ,  Vivek Kishorechand Arora

    IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/482

    Abstract: A semiconductor package includes a leadframe including leads and a die attach pad (DAP) inside the leads, and at least one semiconductor die having a top side including circuitry electrically connected to bond pads and a bottom side attached to a bottom side portion of the DAP. The package includes a mold compound and a heat slug having a top side and a bottom side positioned within a cavity defined by sidewalls of the mold compound. The heat slug has an area greater than an area of the DAP is attached by its bottom side with a thermally conductive adhesive material to a top side portion of the DAP. Bondwires are between the leads and the bond pads. Exposed from the mold compound is a bottom side surfaces of the leads and the top side of the heat slug.

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