公开(公告)号：US11538740B2

公开(公告)日：2022-12-27

申请号：US16511313

申请日：2019-07-15

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jason Chien ,  Yuh-Harng Chien ,  J K Ho

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

Abstract: A semiconductor package includes a first lead with first and second ends extending in the same direction as one another. At least one second lead has first and second ends and is partially surrounded by the first lead. A die pad is provided and a die is connected to the die pad. Wires electrically connect the die to the first lead and the at least one second lead. An insulating layer extends over the leads, the die pad, and the die such that the first end of the at least one second lead is exposed from the semiconductor package and the second end of the first lead is encapsulated entirely within the insulating layer.

公开(公告)号：US11227852B2

公开(公告)日：2022-01-18

申请号：US16854823

申请日：2020-04-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Honglin Guo ,  Jason Chien ,  Byron Lovell Williams ,  Jeffrey Alan West ,  Anderson Li ,  Arvin Nono Verdeflor

IPC: H01L23/00 ,  H01L21/56 ,  H01L25/00 ,  H01L23/495 ,  H01L23/31 ,  H01L25/065

Abstract: An integrated circuit and methods for packaging the integrated circuit. In one example, a method for packaging an integrated circuit includes connecting input/output pads of a first integrated circuit die to terminals of a lead frame via palladium coated copper wires. An oxygen plasma is applied to the first integrated circuit die and the palladium coated copper wires. The first integrated circuit die and the palladium coated copper wires are encapsulated in a mold compound after application of the oxygen plasma.

公开(公告)号：US20210111103A1

公开(公告)日：2021-04-15

申请号：US16600615

申请日：2019-10-14

Applicant: Texas Instruments Incorporated

Inventor： Jason Chien ,  J K Ho ,  Yuh-Harng Chien

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/00

Abstract: A packaged semiconductor device includes a leadframe including a finger pad(s) that is integrated, and spans a finger pad area including a width narrower than its length. A first portion of the finger pad area provides a die support area. A second portion of the finger pad area provides a wire bond area including first and second wire bond pads on a first and second side of the die support area. One of the wire bond pads further includes a lead terminal integrally connected. The IC die has a top side with bond pads and a back side having a non-electrically conductive die attach material attached to the die support area. Bond wires extend from the bond pads to the first and second wire bond pads. A mold compound encapsulates the packaged semiconductor device leaving exposed at least the lead terminal on a bottom side of the packaged semiconductor device.

公开(公告)号：US11081429B2

公开(公告)日：2021-08-03

申请号：US16600615

申请日：2019-10-14

Applicant: Texas Instruments Incorporated

Inventor： Jason Chien ,  J K Ho ,  Yuh-Harng Chien

IPC: H01L23/495 ,  H01L21/00 ,  H01L23/48 ,  H01L23/498 ,  H01L23/00

Abstract: A packaged semiconductor device includes a leadframe including a finger pad(s) that is integrated, and spans a finger pad area including a width narrower than its length. A first portion of the finger pad area provides a die support area. A second portion of the finger pad area provides a wire bond area including first and second wire bond pads on a first and second side of the die support area. One of the wire bond pads further includes a lead terminal integrally connected. The IC die has a top side with bond pads and a back side having a non-electrically conductive die attach material attached to the die support area. Bond wires extend from the bond pads to the first and second wire bond pads. A mold compound encapsulates the packaged semiconductor device leaving exposed at least the lead terminal on a bottom side of the packaged semiconductor device.