公开(公告)号：US20200186120A1

公开(公告)日：2020-06-11

申请号：US16509224

申请日：2019-07-11

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeronimo SEGOVIA FERNANDEZ ,  Peter SMEYS

IPC: H03H9/02 ,  H03H9/25 ,  H03H9/145 ,  H01L41/053 ,  G01L3/10

Abstract: A torque sensor chip including a semiconductor substrate, an acoustic reflector formed on the semiconductor substrate, and first and second Lamb wave resonators (LWRs). The first LWR is formed on a side of the acoustic reflector opposite the semiconductor substrate. The first LWR is at a first angle with respect to an axis of the IC. The second LWR also is formed on the side of the acoustic reflector opposite the semiconductor substrate. The second LWR is at a second angle, different than the first angle, with respect to the axis of the IC.

公开(公告)号：US20220357483A1

公开(公告)日：2022-11-10

申请号：US17515047

申请日：2021-10-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeronimo SEGOVIA FERNANDEZ ,  Ting-Ta YEN ,  Hassan Omar ALI

IPC: G02B1/00 ,  H03H9/17 ,  G02B5/00 ,  G01J1/04

Abstract: An apparatus for an optical detector includes a bulk acoustic wave (BAW) resonator including a piezoelectric layer and a metal layer, an acoustic Bragg mirror on the BAW resonator and including a first acoustic impedance layer and a second acoustic impedance layer different than the first acoustic impedance layer, and a plasmonic metasurface on the acoustic Bragg mirror and including structures of geometric patterns arranged in an array.

公开(公告)号：US20200212880A1

公开(公告)日：2020-07-02

申请号：US16236601

申请日：2018-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeronimo SEGOVIA FERNANDEZ ,  Peter SMEYS ,  Ting-Ta YEN

IPC: H03H9/17 ,  H03H3/02 ,  H03H9/13 ,  C23C14/35 ,  C23C16/455

Abstract: A resonator includes a substrate, an acoustic Bragg mirror disposed above the substrate, and a bottom metal layer disposed above the acoustic Bragg mirror. The resonator also includes a piezoelectric plate disposed above the bottom metal layer. The resonator further includes a top metal layer disposed above the piezoelectric plate. The top metal layer comprises multiple fingers within a single plane and the width of each of the fingers is between 75%-125% of a thickness of the piezoelectric plate.