公开(公告)号：US20240178166A1

公开(公告)日：2024-05-30

申请号：US18072426

申请日：2022-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Rafael Jose Lizares GUEVARA ,  Jose Arvin M. PLOMANTES

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05664 ,  H01L2224/45644 ,  H01L2224/85

Abstract: In some examples, a method for manufacturing a semiconductor package comprises forming a copper member on a surface; applying a photoresist to the copper member and the surface; and forming a cavity in the photoresist above the copper member. The cavity has a first volume with a first diameter and a second volume with a second diameter larger than the first diameter. The second volume is more proximal to the copper member than the first volume. The method also includes forming a nickel member in the second volume forming a palladium member in the first volume.

公开(公告)号：US20250140718A1

公开(公告)日：2025-05-01

申请号：US18498144

申请日：2023-10-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jose Arvin M. PLOMANTES ,  Jeffrey Salvacion SOLAS

IPC: H01L23/00

Abstract: A package comprises a semiconductor die including a device side having circuitry formed therein and a first metal member on the device side of the die and having a top surface facing away from the die. The first metal member includes a group of dielectric members, each dielectric member in the group of dielectric members extending at least partially through a thickness of the first metal member. The package also comprises solder material contacting the top surface of the first metal member and top surfaces of the dielectric members in the group of dielectric members. The package also includes a second metal member coupled to the solder material and to a conductive terminal of the package, the conductive terminal exposed to an exterior of the package.