公开(公告)号：US20230369198A1

公开(公告)日：2023-11-16

申请号：US17936316

申请日：2022-09-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Elizabeth Stewart ,  Jeffrey Alan West ,  Byron Williams ,  Pijush Kanti Ghosh

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/528 ,  H01L25/065 ,  H01L23/532 ,  H01L21/768

CPC classification number: H01L23/5223 ,  H01L21/76832 ,  H01L23/5226 ,  H01L23/5283 ,  H01L23/53295 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/48101 ,  H01L2224/48138 ,  H01L2924/1205

Abstract: The present disclosure generally relates to a capacitor on an integrated circuit (IC) die. In an example, a package includes first and second IC dice. The first IC die includes a first circuit, a capacitor, and a polyimide layer. The first circuit is on a substrate. The capacitor includes a bottom plate over the substrate and a top plate over the bottom plate. The polyimide layer is at least partially over the top plate. A distance from a top surface of the top plate to a bottom surface of the polyimide layer is at least 30 % of a distance from a top surface of the bottom plate to a bottom surface of the top plate. A signal path, including the capacitor, is electrically coupled between the first circuit and a second circuit in the second IC die, which does not include a galvanic isolation capacitor in the signal path.