公开(公告)号：US10589986B2

公开(公告)日：2020-03-17

申请号：US15696245

申请日：2017-09-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph Fruehling ,  Juan Alejandro Herbsommer ,  Simon Joshua Jacobs ,  Benjamin Stassen Cook ,  James F. Hallas ,  Randy Long

IPC: B81B7/00 ,  H03L7/26 ,  G01L7/08 ,  G04F5/14 ,  G01M3/32 ,  G01L9/00

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

公开(公告)号：US10913654B2

公开(公告)日：2021-02-09

申请号：US16813967

申请日：2020-03-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph Fruehling ,  Juan Alejandro Herbsommer ,  Simon Joshua Jacobs ,  Benjamin Stassen Cook ,  James F. Hallas ,  Randy Long

IPC: B81B7/00 ,  H03L7/26 ,  G01L7/08 ,  G04F5/14 ,  G01M3/32 ,  G01L9/00

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.