公开(公告)号：US20230115102A1

公开(公告)日：2023-04-13

申请号：US17587749

申请日：2022-01-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian Meier ,  Siegmund Maier ,  Heinrich Wachinger

IPC: H01L21/66 ,  G01R27/02 ,  H01L21/321 ,  H01L21/67

Abstract: An integrated circuit (IC) fabrication tool and associated method for facilitating inline contactless sheet resistance measurement. In one arrangement, the tool comprises at least one main chamber, one or more processing chambers detachably coupled to the main chamber, each of the one or more processing chambers configured for effectuating a respective processing operation on a semiconductor wafer, and at least one sensor chamber detachably coupled to the at least one main chamber, the at least one sensor chamber having a contactless sensor assembly for sensing sheet resistance of a process layer of the semiconductor wafer based on eddy currents generated in the process layer.