公开(公告)号：US20230194569A1

公开(公告)日：2023-06-22

申请号：US17733999

申请日：2022-04-30

Applicant: Texas Instruments Incorporated

Inventor： Sebastian Meier ,  Helmut Bumberger ,  Heinrich Wachinger

IPC: G01R1/067 ,  G01R31/28 ,  H01L21/66

CPC classification number: G01R1/06783 ,  G01R31/2889 ,  H01L22/14

Abstract: A wafer probe test system has a conductive needle configured to contact a conductive feature on a surface of a wafer, and a fluid probe having a multichannel tube, the fluid probe configured to engage the surface of the wafer to form a fluidic seal between a sensor face on the surface of the wafer and the conductive feature of the wafer, the multichannel tube having a first channel and a second channel configured to create a flow of fluid across the sensor face on the surface of the wafer.

公开(公告)号：US20230115102A1

公开(公告)日：2023-04-13

申请号：US17587749

申请日：2022-01-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian Meier ,  Siegmund Maier ,  Heinrich Wachinger

IPC: H01L21/66 ,  G01R27/02 ,  H01L21/321 ,  H01L21/67

Abstract: An integrated circuit (IC) fabrication tool and associated method for facilitating inline contactless sheet resistance measurement. In one arrangement, the tool comprises at least one main chamber, one or more processing chambers detachably coupled to the main chamber, each of the one or more processing chambers configured for effectuating a respective processing operation on a semiconductor wafer, and at least one sensor chamber detachably coupled to the at least one main chamber, the at least one sensor chamber having a contactless sensor assembly for sensing sheet resistance of a process layer of the semiconductor wafer based on eddy currents generated in the process layer.

公开(公告)号：US11525820B2

公开(公告)日：2022-12-13

申请号：US16572303

申请日：2019-09-16

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sebastian Meier ,  Heinrich Wachinger ,  Bernhard Peter Lange

IPC: G01N33/18 ,  G01N27/07 ,  G01N27/08 ,  H01L21/67

Abstract: In examples, a method of manufacturing a fluid sensing package comprises coupling a semiconductor die to a first set of conductive terminals; positioning the semiconductor die within a socket, a fluid probe extending through a probe orifice in a lid of the socket; positioning a ring of the fluid probe on a fluid sensing portion of the semiconductor die by closing the lid of the socket; and using the fluid probe to apply fluid to an area of the fluid sensing portion circumscribed by the ring.