公开(公告)号：US10910293B1

公开(公告)日：2021-02-02

申请号：US16665459

申请日：2019-10-28

Applicant: Texas Instruments Incorporated

Inventor： ChienHao Wang ,  Bob Lee ,  YuhHarng Chien

IPC: H01L23/495 ,  H01L23/50 ,  H01L23/00

Abstract: A leadframe includes a die pad having a plurality of sides which collectively define the rectangular die pad area including at least two securing sides that include a linear portion with a cantilever interrupting the linear portion. The die pad has a top surface defining a top plane and a bottom surface defining a bottom plane. Lead terminals are beyond the die pad. The cantilevers have a fixed end and a free end opposite the fixed ends that enables flexing or bending responsive to a received force. The free ends include a distal end with an electronic component locking feature. The fixed ends are positioned beyond the die pad area, and the electronic component locking feature extends inward over the rectangular die pad area for providing mechanical support and for securing the electronic component.

公开(公告)号：US20210193590A1

公开(公告)日：2021-06-24

申请号：US16724179

申请日：2019-12-20

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： ChienHao Wang ,  Bob Lee ,  YuhHarng Chien

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  G06T7/00 ,  G06T7/70

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

公开(公告)号：US20220246545A1

公开(公告)日：2022-08-04

申请号：US17719235

申请日：2022-04-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： ChienHao Wang ,  Bob Lee ,  YuhHarng Chien

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  G06T7/00 ,  G06T7/70

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

公开(公告)号：US20240047381A1

公开(公告)日：2024-02-08

申请号：US18488981

申请日：2023-10-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： ChienHao Wang ,  Bob Lee ,  YuhHarng Chien

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  G06T7/00 ,  G06T7/70

CPC classification number: H01L23/562 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49582 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/681 ,  G06T7/0004 ,  G06T7/70 ,  H01L21/4825 ,  G06T2207/30148

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

公开(公告)号：US11791289B2

公开(公告)日：2023-10-17

申请号：US17719235

申请日：2022-04-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： ChienHao Wang ,  Bob Lee ,  YuhHarng Chien

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  G06T7/00 ,  G06T7/70

CPC classification number: H01L23/562 ,  G06T7/0004 ,  G06T7/70 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/681 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49582 ,  G06T2207/30148

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.

公开(公告)号：US11302652B2

公开(公告)日：2022-04-12

申请号：US16724179

申请日：2019-12-20

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： ChienHao Wang ,  Bob Lee ,  YuhHarng Chien

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  G06T7/00 ,  G06T7/70

Abstract: A semiconductor package includes a metallic pad and leads spaced from the metallic pad by a gap, the metallic pad including a roughened surface. The semiconductor package further includes a semiconductor die including bond pads, and an adhesive between the roughened surface of the metallic pad and the semiconductor die, therein bonding the semiconductor die to the metallic pad, wherein the adhesive includes a resin. The metallic pad further includes a groove surrounding the semiconductor die on the roughened surface, the groove having a surface roughness less than a surface roughness of the roughened surface of the metallic pad.