公开(公告)号：US20150129292A1

公开(公告)日：2015-05-14

申请号：US14365070

申请日：2012-12-11

Applicant: THALES

Inventor： Bernard Ledain ,  Dominique Henriot ,  Philippe Kertesz

IPC: H05K3/46 ,  H05K1/09 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K3/4623 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/115 ,  H05K3/4614 ,  H05K2201/0129 ,  H05K2201/041 ,  H05K2201/10378 ,  H05K2203/063 ,  Y10T29/49124

Abstract: A process is provided for producing a printed circuit board comprising at least two elementary circuit boards drilled with metallized holes the mouth of which is covered with a first metal, and at least one first intermediate layer, made of a compressible material, drilled with holes facing the elementary circuit boards and the mouth of which is covered with a second metal, which layer is placed between the two elementary circuit boards and soldered to each of the circuits by thermodiffusion of two metals forming an alloy at a formation temperature of the alloy. At least two second intermediate layers, the second layers not covering the first and second metal, being thermoplastics and having a melting point above the formation temperature of the alloy, are placed between the first intermediate layer and the elementary circuit boards.

Abstract translation: 提供了一种用于生产印刷电路板的方法，该印刷电路板包括至少两个基本电路板，所述至少两个基本电路板钻有金属化孔，其孔被第一金属覆盖，以及至少一个由可压缩材料制成的第一中间层， 基本电路板，其口部被第二金属覆盖，该层被放置在两个基本电路板之间，并且通过在合金的形成温度下形成合金的两种金属的热扩散而被焊接到每个电路。 至少两个第二中间层，不覆盖第一和第二金属的第二层是热塑性塑料并且具有高于合金的形成温度的熔点，放置在第一中间层和基本电路板之间。