公开(公告)号：US20230058595A1

公开(公告)日：2023-02-23

申请号：US17793199

申请日：2021-01-22

Applicant: THALES ,  CENTRE NATIONAL D'ETUDES SPATIALES ,  UNIVERSITE PAUL SABATIER TOULOUSE III ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE

Inventor： Frédéric VERON ,  Olivier VENDIER ,  Philippe TAILHADES ,  Valérie BACO-CARLES ,  Kateryna KIRYUKHINA

IPC: B22F12/40 ,  B22F10/28 ,  B22F1/145 ,  B22F1/16 ,  C22C1/10 ,  B33Y10/00 ,  B33Y70/10 ,  B33Y40/10

Abstract: A process for manufacturing a multi-material part by additive manufacturing, includes the following steps: a) a step of providing a pre-treated metal powder comprising grains and an oxidized and porous layer on a surface of the grains; b) a selective laser powder-bed fusion step comprising implementation of steps i) and ii) as follows: i) a step of forming a layer from the pre-treated metal powder; ii) a step of melting by laser the layer, the melting step being carried out under a reactive atmosphere and comprising changing parameters of application of the laser so that at least a first region of the layer is converted so as to lower the electrical conductivity thereof, thus forming a dielectric, and so that at least a second region of the layer is densified without converting it, the at least a first region being formed when the parameters of application of the laser allow a first energy density to be applied to the first region and/or the laser beam to be kept for a first dwell time on the first region, the at least a second region being formed when the parameters of application of the laser allow a second energy density to be applied to the second region and/or the laser beam to be kept for a second dwell time on the second region, and the first energy density being higher than the second energy density and/or the first dwell time being longer than the second dwell time. A part obtained using the process is also provided.

公开(公告)号：US20150181694A1

公开(公告)日：2015-06-25

申请号：US14575720

申请日：2014-12-18

Applicant: THALES ,  CENTRE NATIONAL D'ETUDES SPATIALES

Inventor： Olivier VENDIER ,  David NEVO ,  Antoine RENEL ,  Beatrice ESPANA

IPC: H05K1/02 ,  H05K3/10 ,  B22F7/04 ,  H05K1/11

CPC classification number: H05K1/0237 ,  B22F7/04 ,  H01L24/01 ,  H01L2224/48137 ,  H01P1/047 ,  H01P5/028 ,  H05K1/028 ,  H05K1/0284 ,  H05K1/111 ,  H05K3/102

Abstract: A hyperfrequency interconnection device between two components is provided, each component comprising an upper face and a signal line arranged on the upper face, the planes containing the upper faces of the components being separated by a distance known as the height difference. The hyperfrequency interconnection device comprises a substrate comprising a lower face and an upper face defined by a first axis and a second axis perpendicular to the first axis, a signal line arranged on the lower face of the substrate, a projection of the signal line into the plane of the upper face forming the first axis, at least two contact pads capable of electrically connecting the signal line of the device to the signal line of the components. The upper face of the substrate is corrugated along the second axis, capable of conferring on the substrate flexibility along the first axis.

Abstract translation: 提供了两个部件之间的超频互连装置，每个部件包括布置在上表面上的上表面和信号线，包含部件的上表面的平面被隔开已知为高度差的距离。 超频互连装置包括基板，该基板包括由第一轴线和垂直于第一轴线的第二轴限定的下表面和上表面，布置在基板的下表面上的信号线，将信号线投影到 形成第一轴的上表面的平面，至少两个接触垫，其能够将装置的信号线电连接到部件的信号线。 衬底的上表面沿着第二轴线是波纹状的，能够赋予衬底沿着第一轴线的柔性。

公开(公告)号：US20230198256A1

公开(公告)日：2023-06-22

申请号：US18079573

申请日：2022-12-12

Applicant: THALES

Inventor： Thomas ROBE ,  Thierry ADAM ,  Olivier VENDIER ,  Benjamin THEROND

IPC: H02J3/00

CPC classification number: H02J3/0012

Abstract: A system includes input or output channels linked to nominal and redundant equipment items, and at least one redundancy matrix for routing the signals of a channel from one equipment item to a redundant or nominal equipment item, represented by a connection grid having rows corresponding to the channels of the system and columns corresponding to the equipment items of the system, and connection points comprising: the points of intersection of a nominal path situated on a nominal diagonal of the connection grid, and the points of intersection of a redundant path of the connection grid situated between each row corresponding to a channel Ci and a column corresponding to a redundant element Rƒ(i) of index ƒ(i), f being surjective, the redundancy matrix being implemented in the form of a circuit comprising switches arranged according to the connection grid.

公开(公告)号：US20180269552A1

公开(公告)日：2018-09-20

申请号：US15917448

申请日：2018-03-09

Applicant: THALES

Inventor： Olivier VENDIER ,  Raoul RODRIGUEZ ,  Pierre-Yves CHABAUD ,  Dominique POTUAUD ,  Jérôme BATTUT ,  Johann BORNET ,  Thierry ADAM ,  Jean-François VILLEMAZET ,  François GROJEAN

IPC: H01P1/10 ,  H04B7/185

CPC classification number: H01P1/127 ,  H01H1/0036 ,  H01H2001/0042 ,  H01P1/125 ,  H03K17/18 ,  H04B7/18515

Abstract: A microwave switching device comprises: a switching matrix with M inputs and N outputs comprising at least one surface-mount microwave switch with ohmic contacts with at least one input and at least one output position; a control bus for the one or more microwave switches of the switching matrix; a telemetry bus for the M inputs; a telemetry bus for the N outputs; a bias tee positioned on each input of the switching matrix; and a bias tee positioned on each output of the switching matrix.