-
公开(公告)号：US11270892B2
公开(公告)日：2022-03-08
申请号：US16264979
申请日：2019-02-01
IPC分类号： H01L21/3213 , H01L21/768 , H01L43/12 , H01L23/552
摘要： A microfabrication process includes: (1) etching a shield pattern into a substrate; (2) forming a set of shielding layers on the substrate and in the shield pattern, wherein the shielding layers include n+1 magnetic layers and n spacing layers, n is 0 or an integer that is 1 or greater than 1, and each spacing layer is disposed between a pair of magnetic layers; and (3) planarizing the substrate to expose edges of the shielding layers.
-
公开(公告)号：US20150129772A1
公开(公告)日：2015-05-14
申请号：US14517420
申请日：2014-10-17
IPC分类号： H01J37/141
CPC分类号： H01J37/141 , G21K1/093 , H01J2237/141 , H01J2237/1415 , H05H7/04 , H05H9/005
摘要： A structure includes multiple electromagnets with sub-100 micrometer feature size. Each electromagnet includes a substrate defining multiple filled trenches with conductive fillers, a first isolation layer disposed over the conductive fillers such that a portion of each conductive filler is exposed by the first isolation layer, a core disposed over the first isolation layer, and a second isolation layer covering the core. The second isolation layer has a top surface, and winding interconnects extend from a plane defined by the top surface of the second isolation layer to the conductive fillers such that each winding interconnect contacts one of the conductive fillers on a portion exposed by the first isolation layer. A conductive layer includes upper connectors to electrically connect winding interconnects positioned on opposite sides of the core. The trenches, winding interconnects, and upper connectors are electrically connected to form windings around the core.
摘要翻译： 一种结构包括具有亚100微米特征尺寸的多个电磁体。 每个电磁体包括限定具有导电填料的多个填充沟槽的衬底，设置在导电填料上方的第一隔离层，使得每个导电填料的一部分被第一隔离层暴露，设置在第一隔离层上的芯和第二隔离层 隔离层覆盖核心。 第二隔离层具有顶表面，并且绕组互连从由第二隔离层的顶表面限定的平面延伸到导电填料，使得每个绕组互连件在由第一隔离层暴露的部分上接触一个导电填料 。 导电层包括用于电连接位于芯的相对侧上的绕组互连件的上连接器。 沟槽，绕组互连和上连接器电连接以形成围绕芯的绕组。
-
搜索结果
2 条记录 (耗时 0.015 秒)
