公开(公告)号：US10471682B2

公开(公告)日：2019-11-12

申请号：US15513905

申请日：2015-08-07

Applicant: TOAGOSEI CO., LTD.

Inventor： Yuya Okimura ,  Masashi Yamada

IPC: B32B7/12 ,  B32B27/00 ,  C09J123/26 ,  C09J151/06 ,  B32B15/20 ,  B32B27/06 ,  B32B27/32 ,  B32B27/38 ,  H01B3/40 ,  H01B3/44 ,  H01B7/04 ,  H01B7/08 ,  H05K1/03 ,  C09J7/30 ,  C08F255/04 ,  B32B7/04 ,  B32B7/06 ,  B32B15/08 ,  B32B15/088 ,  B32B15/09 ,  B32B15/12 ,  B32B27/08 ,  B32B27/10 ,  B32B27/28 ,  B32B27/34 ,  B32B27/36 ,  B32B29/00 ,  H01B1/02 ,  H05K1/09 ,  H05K3/38

Abstract: An adhesive composition, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in the B stage, and which is excellent in storage stability of the laminate, are provided. The adhesive composition includes a modified polyolefin-based resin and an epoxy resin, in which the modified polyolefin-based resin is a resin resulting from graft-modification of an unmodified olefin resin with a modifying agent containing an α,β-unsaturated carboxylic acid or derivative thereof, wherein the content of the modified polyolefin-based resin is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the modified polyolefin-based resin; and the dielectric constant of a cured body of the adhesive is less than 2.5 as measured at a frequency of 1 GHz.

公开(公告)号：US10472496B2

公开(公告)日：2019-11-12

申请号：US15022630

申请日：2014-09-08

Applicant: TOAGOSEI CO., LTD.

Inventor： Masaru Takashima ,  Yuya Okimura ,  Masashi Yamada

IPC: C08K5/5357 ,  C09J109/06 ,  B32B15/08 ,  B32B15/20 ,  B32B27/28 ,  B32B27/34 ,  H05K3/28 ,  C09J153/00 ,  H05K1/02 ,  H05K3/46 ,  C09J109/02 ,  C09J7/22 ,  C09J7/30 ,  C09J7/25 ,  C08K5/00 ,  C08K5/5317 ,  H05K1/03 ,  H05K3/30 ,  H05K3/38

Abstract: The flame-retardant adhesive composition contains a styrene-based elastomer containing a carboxyl group, an epoxy resin, and a phosphorus-containing oligomer including a structural unit represented by general formula (1), and the epoxy resin content is 1-20 parts by mass and the phosphorus-containing oligomer content is 10-50 parts by mass with respect to 100 parts by mass of the styrene-based elastomer containing carboxyl groups. (wherein, R1 and R2 are each independently a hydrogen atom or a methyl group, n is an integer of 1-20.)