Electronic component, antenna and RF tag

    公开(公告)号:US11228106B2

    公开(公告)日:2022-01-18

    申请号:US16481900

    申请日:2018-01-29

    Abstract: The present invention relates to an electronic component, and also relates to an antenna for information communication using a magnetic field component, which is capable of satisfying both of downsizing and improvement in communication sensitivity. The electronic component of the present invention comprises a ferrite core and a coil, in which a ferrite constituting the ferrite core has a spinel structure and comprises Fe, Ni, Zn, Cu and Co as constitutional metal elements, and when contents of the respective constitutional metal elements in the ferrite are calculated in terms of Fe2O3, NiO, ZnO, CuO and CoO, contents of Fe2O3, NiO, ZnO, CuO and CoO in the ferrite are 46 to 50 mol %, 20 to 27 mol %, 15 to 22 mol %, 9 to 11 mol % and 0.01 to 1.0 mol %, respectively, based on a total content of Fe2O3, NiO, ZnO, CuO and CoO.

    Ferrite particles for bonded magnets, resin composition for bonded magnets, and molded product using the same

    公开(公告)号:US12246475B2

    公开(公告)日:2025-03-11

    申请号:US18379809

    申请日:2023-10-13

    Abstract: The present invention relates to ferrite particles for bonded magnets and a resin composition for bonded magnets which can provide a bonded magnet molded product capable of realizing a high magnetic force and a complicated multipolar waveform owing to such a feature that the ferrite particles are readily and highly oriented against an external magnetic field in a flowing resin upon injection molding, as well as a bonded magnet molded product obtained by injection-molding the above composition. According to the present invention, there are provided ferrite particles for bonded magnets which have a crystallite size of not less than 500 nm as measured in an oriented state by XRD, and an average particle diameter of not less than 1.30 μm as measured by Fisher method; a resin composition for bonded magnets; and a molded product obtained by injection-molding the composition.

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