公开(公告)号：US20250140581A1

公开(公告)日：2025-05-01

申请号：US18924328

申请日：2024-10-23

Applicant: Tokyo Electron Limited

Inventor： Masami YAMASHITA ,  Tatsuya NAGAMATSU

IPC: H01L21/67 ,  G05B19/4099 ,  H01L21/306 ,  H01L21/677

Abstract: A substrate processing apparatus includes: an immersion processor for collectively immersing a set of one or more substrates in a processing liquid and process the set; a standby bath for immersing the set in a rinsing liquid; a first transferer for transferring the set from the immersion processor to the standby bath; a first deliverer for accommodating the set after the immersion in the standby bath; a second transferer for transferring the set from the standby bath to the first deliverer; a single-wafer processor for processing the substrates one by one; a second deliverer for accommodating the substrates processed by the single-wafer processor; a third transferer for transferring the substrates one by one between the first and second deliverers and the single-wafer processor; and a controller for controlling the above-described components to execute a series of substrate processes.

公开(公告)号：US20240096650A1

公开(公告)日：2024-03-21

申请号：US18367742

申请日：2023-09-13

Applicant: Tokyo Electron Limited

Inventor： Shogo FUKUI ,  Masami YAMASHITA ,  Tomofumi EMURA

IPC: H01L21/67

CPC classification number: H01L21/67023 ,  H01L21/6719 ,  H01L21/67248 ,  H01L21/67253

Abstract: A substrate processing apparatus of processing a substrate by using a processing fluid in a supercritical state, the substrate processing apparatus includes: a processing container in which the substrate is accommodated; a supply line connecting the processing container to a fluid source configured to send out the processing fluid in the supercritical state; a discharge line configured to discharge the processing fluid from the processing container; a control valve interposed in the discharge line; and a controller configured to control a pressure in the processing container by adjusting an opening degree of the control valve. In a circulation process in which the processing fluid is supplied to the processing container from the supply line, the controller is configured to adjust the opening degree of the control valve such that each of a pressure-lowering step and a pressure-raising step.

公开(公告)号：US20160035564A1

公开(公告)日：2016-02-04

申请号：US14809373

申请日：2015-07-27

Applicant: TOKYO ELECTRON LIMITED ,  JSR CORPORATION

Inventor： Meitoku AIBARA ,  Yuki YOSHIDA ,  Hisashi KAWANO ,  Masami YAMASHITA ,  Itaru KANNO ,  Kenji MOCHIDA ,  Motoyuki SHIMA

IPC: H01L21/02 ,  B08B3/08

CPC classification number: H01L21/02057 ,  B08B3/08 ,  H01L21/02041 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6715

Abstract: An object of the present invention is to be able to obtain a high removing performance of particles. The substrate processing method according to the exemplary embodiment comprises a film-forming treatment solution supply step and a removing solution supply step. The film-forming treatment solution supply step comprising supplying to a substrate, a film-forming treatment solution containing an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent is supplied. The removing solution supply step comprises supplying to a treatment film formed by solidification or curing of the film-forming treatment solution on the substrate, a removing solution capable of removing the treatment film.

Abstract translation: 本发明的目的是能够获得颗粒的高去除性能。 根据示例性实施例的基板处理方法包括成膜处理溶液供应步骤和去除溶液供应步骤。 提供成膜处理溶液供应步骤，其包括供给基材，含有有机溶剂的成膜处理溶液和可溶于有机溶剂的含氟聚合物。 去除溶液供给步骤包括向通过基板上的成膜处理溶液的固化或固化形成的处理膜提供能够除去处理膜的去除溶液。

公开(公告)号：US20160035561A1

公开(公告)日：2016-02-04

申请号：US14809387

申请日：2015-07-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Meitoku AIBARA ,  Yuki YOSHIDA ,  Hisashi KAWANO ,  Masami YAMASHITA ,  Itaru KANNO ,  Kenji MOCHIDA ,  Motoyuki SHIMA

IPC: H01L21/02 ,  B08B3/08

CPC classification number: B08B3/08 ,  H01L21/02057 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6715

Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.

Abstract translation: 本发明的目的是获得颗粒的高去除性能。 根据示例性实施例的基板处理系统包括保持单元和去除溶液供应单元。 保持单元保持其上形成有处理膜的基板，其中处理膜包括可溶于有机溶剂的有机溶剂和含氟聚合物。 除去溶液供给单元供给到在基板上形成的处理膜，能够除去处理膜的除去溶液。